The Future Of Digital Engineering In The Age Of AI


Digital engineering gives innovators creative agency to test the limits of their ideas in a virtual environment. It is in this convergence of digital technologies, data-driven models, and advanced simulations where new designs are born at unprecedented levels of speed and accuracy. Adding artificial intelligence (AI) into the mix further accelerates innovation by unlocking opportunities to a... » read more

Navigating Vehicle Engineering In A Software-Defined World: Ebook


The e-book “Navigating Vehicle Engineering in a Software-Defined World” explores the transformative shift in the automotive industry toward software-defined vehicles (SDVs), a groundbreaking evolution from traditional hardware-focused designs to software-centric systems. It highlights how advancements in microprocessor technology and the emergence of over-the-air (OTA) updates have enabled ... » read more

LLMs Add Safety Risks To Physical AI


Humanoid robots with artificial general intelligence are some years from entering our daily life, but application-specific robotics are already here. From Amazon’s fleet of fulfillment center robots to robotic surgical systems in operating rooms, search and rescue robo-dogs, autonomous drones, and last-mile delivery robots, all the way down to the humble Roomba vacuum cleaner, physical AI sys... » read more

Blog Review: Nov. 5


Synopsys' Igor Markov points out how numerical simulation tools advance quantum computing R&D by capturing both quantum-mechanical behavior and classical electromagnetic effects so researchers can evaluate design alternatives before fabrication and gain insight into how devices operate under realistic conditions. Siemens' Stephen V. Chavez finds that impedance modeling and control are mi... » read more

The Next Big Thing


Sometimes, we spend so much time looking for the next big thing that we actually miss something even bigger. I have to admit I was guilty of this while employed by a large EDA company 20 years ago. I was one of those ESL people — Electronic System Level acolytes, with Gary Smith as our standard bearer. We wanted to do many things, including raising the level of abstraction for design and veri... » read more

Thermal, Mechanical, And Material Stresses Grow With Die Stacking


Managing thermal and mechanical stress in multi-die assemblies will require a detailed knowledge of how and where a device will be used, how it will be packaged, and where stresses could cause problems at any point during its expected lifetime. This includes everything from workload-dependent thermal gradients to mechanical and electrical stress, which may become more pronounced over time wi... » read more

Blog Review: Oct. 29


Siemens' Ujjwal Negi and Prashant Dixit warn that while UCIe 3.0 improves performance and efficiency through higher data rates, runtime recalibration, priority sideband messaging, low-power sideband operation, and circular buffer transport, those enhancements also increase verification complexity. Cadence's Anika Sunda suggests that a unified digital thread that connects verification environ... » read more

Digital Twins For Packaging: Bridging Design, Fab, Test, And Reliability


Digital twins dominated discussions at SEMICON West this year, appearing in keynote presentations, panel sessions, and workshops. The conversation reflected a noticeable shift in how the industry views the technology. What once was mainly associated with design exploration now spans the manufacturing lifecycle. In packaging and assembly, digital twins are emerging as a way to connect design ... » read more

Blog Review: Oct. 22


Cadence's Sandip Sadadiya shows what's new in the AMBA AXI Issue L protocol update, which introduces a new credit-based transport mechanism that replaces the traditional VALID/READY handshake, along with improved flow control mechanisms. Siemens' Farhad Ahmed highlights the growing need to do clock domain crossing (CDC) and reset domain crossing (RDC) analysis in a hierarchical way and intro... » read more

Chip Industry Week in Review


The Open Compute Project (OCP) Summit kicked off this week in San Jose, dominated by open standards, massive scaling of AI infrastructure, chiplet architectures, and energy-efficiency. Among the highlights: An initiative to standardize data center infrastructure and advance Ethernet for AI. New contributions to OCP's Open Chiplet Economy ecosystem, including Arm's new Foundation Chiplet... » read more

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