Meanwhile, Back In Barcelona…


We recently wrapped up another successful IoT Solutions World Congress (IoTSWC), hosted by the Industrial Internet Consortium (IIC) in Barcelona. We’ve been participating in the Congress since its inception three years ago, and this year was particularly exciting given the Catalonia Independence Referendum happening at the same time. Even with this as a backdrop, the event attracted 50 percen... » read more

The Week in Review: IoT


Finance Automile, an Internet of Things company involved in field-service businesses, has received $34 million in Series B funding led by Insight Venture Partners, bringing its total funding to $47 million. Existing investors Dawn Capital, Point Nine Capital, SaaStr Fund, and Salesforce Ventures also participated in the new round. Automile will use the money on marketing, product developmen... » read more

Blog Review: Oct. 25


Mentor's Joe Hupcey III explains the benefits of prioritizing faults with formal analysis before launching detailed fault verification. Cadence's Paul McLellan listens in as AMD's Mark Papermaster discusses what's needed to keep driving Moore's Law. Synopsys' Jesse Victors takes a look at ROCA, the latest flaw affecting RSA cryptography, and argues it may be time for a new encryption sche... » read more

Making high-capacity data caches more efficient


Source: Researchers from MIT, Intel, and ETH Zurich Xiangyao Yu (MIT), Christopher J. Hughes (Intel), Nadathur Satish (Intel) Onur Mutlu (ETH Zurich), Srinivas Devadas (MIT) Technical Paper link MIT News article As the transistor counts in processors have gone up, the relatively slow connection between the processor and main memory has become the chief impediment to improving comp... » read more

Manufacturing Bits: Oct. 24


Redefining unit measurements At a recent meeting, the International Committee for Weights and Measures (CIPM) took the next step towards the expected redefinition of four base units within the International System of Units (SI). The SI base units include the following metrics or constants--meter, kilogram, second, ampere, kelvin, mole, and the candela. Here’s the fundamental constant... » read more

System Bits: Oct. 24


Optical communication on silicon chips With the huge increase in computing performance in recent decades achieved by squeezing ever more transistors into a tighter space on microchips, at the same time this downsizing has also meant packing the wiring within microprocessors ever more tightly together. This has led to effects such as signal leakage between components, which can slow down commun... » read more

Searching For EUV Mask Defects


Chipmakers hope to insert extreme ultraviolet (EUV) lithography at 7nm and/or 5nm, but several challenges need to be solved before this technology can be used in production. One lingering issue that is becoming more worrisome is how to find [gettech id="31045" comment="EUV"] mask defects. That isn't the only issue, of course. The industry continues to work on the power source and resists. Bu... » read more

What’s Up With MEMS?


New sensor technologies, and smarter ways of integrating more intelligence, continue to generate unexpected opportunities in the changing MEMS business. Changes needed for sensors for context awareness If digital assistants are ever going to be really useful, they’ll need some particular sensor capabilities to understand emotion, suggests Lama Nachman, head of Intel’s Anticipatory Compu... » read more

Next-Gen Mask Writer Race Begins


Competition is heating up in the mask writer equipment business as two vendors—Intel/IMS and NuFlare—vie for position in the new and emerging multi-beam tool segment. Last year, Intel surprised the industry by acquiring IMS Nanofabrication, a multi-beam e-beam mask writer equipment vendor. Also last year, IMS, now part of Intel, began shipping the world’s first multi-beam mask writer f... » read more

Memory Test Challenges, Opportunities


The semiconductor capital equipment market is on fire, and the memory chip test equipment sector is no different. But it is getting much more difficult on the memory side. Memory test vendors are contending with next-generation devices, such as 3D NAND flash memories, HBM2 chips, low-power double-data-rate DRAMs, graphics DRAMs, phase-change memories, magnetoresistive RAMs, and resistive RAM... » read more

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