A new technical paper titled “Shrinking interconnects beyond copper” was published by researchers at Florida State University and Cornell University.
Excerpt
“The continuous downscaling of transistors in integrated circuits following Moore’s law—doubling the number of transistors on a microchip about every 2 years—has been an extraordinary feat of engineering, pushing the limits of fundamental physics. A transistor is a key component that regulates electrical current flow between terminals (conductive connection points) by switching the current on or off. When the size of a transistor decreases, the switching speed increases, allowing an integrated circuit to process information more rapidly. However, as a transistor’s dimensions scale down to the nanometer regime, interconnects—the metal wires that connect transistors and other circuit components on a microchip—become a major bottleneck for the processing speed. Thus, advancing the performance of integrated circuits for next-generation electronic devices cannot be achieved solely through downscaling of transistors but requires the development of new interconnect materials.”
Find the technical paper here. November 2025.
Kiani, Mehrdad T., and Judy J. Cha. “Shrinking interconnects beyond copper.” Science 390, no. 6773 (2025): 572-573.
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