Chip Industry’s Technical Paper Roundup: Jan. 8

New technical papers added to Semiconductor Engineering’s library this week. [table id=183 /] More ReadingTechnical Paper Library home » read more

Challenges And Innovations Of HW Security And Trust For Chiplet-Based 2.5D and 3D ICs

A technical paper titled “On hardware security and trust for chiplet-based 2.5D and 3D ICs: Challenges and Innovations” was published by researchers at STMicroelectronics Crolles (ST-CROLLES), Département Systèmes et Circuits Intégrés Numériques (DSCIN), Techniques de l'Informatique et de la Microélectronique pour l'Architecture des systèmes intégrés (TIMA), and Laboratoire Systèm... » read more