System Bits: July 16


Test tube AI neural network In a significant step towards demonstrating the capacity to program artificial intelligence into synthetic biomolecular circuits, Caltech researchers have developed an artificial neural network made out of DNA that can solve a classic machine learning problem: correctly identifying handwritten numbers. The work was done in the laboratory of Lulu Qian, assistant p... » read more

Tuesday At DAC 2018


The morning starts with the Accellera Breakfast. Accellera has made some significant progress this year and we can expect to hear about the approval of the Portable Stimulus 1.0 specification later in the conference as well as the initial release of SystemC CCI as well as a proposal for the creation of an IP Security Assurance Working Group, which will discuss standards development to address s... » read more

Monday At DAC 2018


DAC #55 started with rumors flying. Will this be the last DAC as we know it? Is there a huge chasm forming between academia and the industry? Will DAC be able to make it in Las Vegas where there is no local interest? Of course, those who have been in the industry know that this kind of speculation happens every few years, and in the 80s, Las Vegas was a very popular location for DAC. There was ... » read more

IBM Takes AI In Different Directions


Jeff Welser, vice president and lab director at IBM Research Almaden, sat down with Semiconductor Engineering to discuss what's changing in artificial intelligence and what challenges still remain. What follows are excerpts of that conversation. SE: What's changing in AI and why? Welser: The most interesting thing in AI right now is that we've moved from narrow AI, where we've proven you... » read more

System Bits: Feb. 6


Compressing data in vehicles As the number of cameras in automobiles is on the rise with the move to autonomous vehicles, internal vehicle networks are being pushed to their limits from the flood of data. While special compression methods reduce the amount of video data, they also exhibit a high degree of latency for coding. But now, Fraunhofer researchers have adapted video compression in su... » read more

What’s Next With Computing?


At the recent IEDM conference, Jeff Welser, vice president and lab director at IBM Research Almaden, sat down to discuss artificial intelligence, machine learning, quantum computing and supercomputing with Semiconductor Engineering. Here are excerpts of that conversation. SE: Where is high-end computing going? Welser: We are seeing lots of different systems start to come up. First of all,... » read more

Power/Performance Bits: March 21


Tiny redox flow batteries for chips Researchers at ETH Zurich and IBM Research Zurich built a tiny redox flow battery capable of both powering and cooling stacks of chips. In a flow battery, an electrochemical reaction is used to produce electricity out of two liquid electrolytes, which are pumped to the battery cell from outside via a closed electrolyte loop. Such batteries are usually u... » read more

Power/Performance Bits: March 14


Magnetic storage on one atom Scientists at IBM Research created a single-atom magnet and were able to store one bit of data on it, making it the world's smallest magnetic storage device. Using electrical current, the researchers showed that two magnetic atoms could be written and read independently even when they were separated by just one nanometer. This tight spacing could, the team hop... » read more

Joint R&D Has Its Ups And Downs


As corporate spending on research and development dwindles, enterprises are reaching out to colleges and universities to supplement their R&D. And they often are finding eager partners in those endeavors, as professors and their graduate students look for help, financial and technical, in addressing long-term research projects. “Pure research is just a luxury no one can afford anymore,... » read more

Bulk CMOS Vs. FD-SOI


The leading edge of the chip market increasingly is divided over whether to move to finFETs or whether to stay at 28nm using different materials and potentially even advanced packaging. Decisions about which approach to take frequently boil down to performance, power, form factor, cost, and the maturity of the individual technologies. All of those can vary by market, by vendor and by process... » read more

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