Ensuring Accuracy in LLM-Generated Hardware Logic Design Automation (IBM Research)


A new technical paper "Mitigating hallucinations and omissions in LLMs for invertible problems: An application to hardware logic design automation" was published by researchers at IBM Research. Abstract "We show for invertible problems that transform data from a source domain (for example, Logic Condition Tables (LCTs)) to a destination domain (for example, Hardware Description Language (... » read more

Powering Efficiency: AI Transforms IC Manufacturing As ICs Fuel AI


The push to grow today’s $500 billion-plus semiconductor industry to $1 trillion in annual revenue is challenging every aspect of the broader supply chain to embrace AI. Artificial intelligence is transforming the way fabs are architected and run, how devices are manufactured, and how server farms are constructed going forward. At the same time, all of this is being enabled by advancements... » read more

Chip Industry Week in Review


Samsung and SK hynix joined OpenAI's Stargate initiative to ensure there will be enough memory chips to meet the needs of AI data centers. The goal is to produce up to 900,000 DRAM wafer starts per month. OpenAI also inked agreements to explore the development of next-gen data centers in Korea. Axcelis Technologies (ion implantation systems) will merge with Veeco Instruments (compound semic... » read more

Machine Learning Tools Help Bridge Design-To-Manufacturing Gap


More aggressive feature scaling and increasingly complex transistor structures are driving a steady increase in process complexity, increasing the risk that a specified pattern may not be manufacturable with an acceptable yield. A single layer now requires more process steps, and each of those entails more tunable parameters than ever before. To help manage design risk, foundries provide det... » read more

Chip Industry Technical Paper Roundup: July 15


New technical papers recently added to Semiconductor Engineering’s library: [table id=446 /] Find more semiconductor research papers here. » read more

Chip Industry Week In Review


GlobalFoundries plans to acquire MIPS, adding RISC-V processor IP and PPA optimization software capabilities to its foundry offerings. MIPS will continue to operate as a standalone business within GF. The deal is expected to close in the second half of 2025. The EU rolled out new general-purpose AI rules this week to limit copyright infringement, protect public safety, and require transparency... » read more

NVIDIA GPU Confidential Computing: Threat Model And Security Insights (IBM Research, Ohio State)


A new technical paper titled "NVIDIA GPU Confidential Computing Demystified" was published by IBM Research and Ohio State University. Abstract "GPU Confidential Computing (GPU-CC) was introduced as part of the NVIDIA Hopper Architecture, extending the trust boundary beyond traditional CPU-based confidential computing. This innovation enables GPUs to securely process AI workloads, providing ... » read more

Novel Assembly Approaches For 3D Device Stacks


The next big leap in semiconductor packaging will require a slew of new technologies, processes, and materials, but collectively they will enable orders of magnitude improvement in performance that will be essential for the AI age. Not all of these issues are fully solved but the recent Electronic Components Technology Conference (ECTC) provided a glimpse into the huge leaps in progress that... » read more

Chip Industry Technical Paper Roundup: June 24


New technical papers recently added to Semiconductor Engineering’s library: [table id=442 /] Find more semiconductor research papers here. » read more

Chip Industry Technical Paper Roundup: June 17


New technical papers recently added to Semiconductor Engineering’s library: [table id=440 /] Find more semiconductor research papers here.   » read more

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