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Manufacturing Bits: Feb. 16


Hybrid bonding consortium for packaging A*STAR’s Institute of Microelectronics (IME) and several companies have formed a new consortium to propel the development of hybrid bonding technology for chip-packaging applications. The group, called the Chip-to-Wafer (C2W) Hybrid Bonding Consortium, includes A*STAR’s IME organization, Applied Materials, ASM Pacific, Capcon, HD MicroSystems, ONT... » read more

Week In Review: Manufacturing, Test


Chipmakers The U.S. Semiconductor Industry Association (SIA) and several chip executives have sent a joint letter to President Biden, urging the administration to include substantial funding for semiconductor manufacturing and research in the U.S. As reported, the share of global semiconductor manufacturing capacity in the U.S. has decreased from 37% in 1990 to 12% today. “Semiconductors pow... » read more

Manufacturing Bits: May 31


Superconducting magnets The National High Magnetic Field Laboratory (MagLab) has broken another world’s magnet record. This time, MagLab broke a record for a high-temperature superconducting (HTS) coil operating inside a high-field resistive magnet. With the technology, the agency achieved a magnetic field of 40.2 teslas. The previous record was 35.4 teslas. Tesla, or T, is the measuremen... » read more

Manufacturing Bits: March 29


Brain-inspired computing Lawrence Livermore National Laboratory (LLNL) has purchased a brain-inspired supercomputing platform for deep learning developed by IBM Research. Based on a neurosynaptic computer chip called IBM TrueNorth, the scalable platform will process the equivalent of 16 million neurons and 4 billion synapses. It will consume the energy equivalent of a tablet computer. ... » read more