tag: CNRS

Research Bits: Jan. 23
By Jesse Allen - 23 Jan, 2024 - Comments: 0

Memristor-based Bayesian neural network Researchers from CEA-Leti, CEA-List, and CNRS built a complete memristor-based Bayesian neural network implementation for classifying types of arrhythmia recordings with precise aleatoric and epistemic uncertainty. While Bayesian neural networks are useful for at sensory processing applications based on a small amount of noisy input data because they ... » read more

Chip Industry Week In Review
By The SE Staff - 19 Jan, 2024 - Comments: 0

By Jesse Allen, Gregory Haley, and Liz Allan Synopsys will acquire Ansys for about $35 billion in cash and stock. The deal will boost Synopsys' multi-physics simulation capabilities, which are essential for complex 3D-IC designs, where thermal density can have significant repercussions. The acquisition is expected to be finalized in the first half of 2025. Worldwide semiconductor revenue ... » read more

Chip Industry Technical Paper Roundup: Jan 2
By Linda Christensen - 02 Jan, 2024 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=180 /] More ReadingTechnical Paper Library home » read more

Nanoscale Reconfigurable Si Transistors (TU Wien, CNRS, UNC)
By Technical Paper Link - 20 Dec, 2023 - Comments: 0

A new technical paper titled "Nanoscale Reconfigurable Si Transistors: From Wires to Sheets and Unto Multi-Wire Channels" was published by researchers at TU Wien, CNRS, and University of North Carolina at Chapel Hill. Abstract: "In this work, bottom-up Al–Si–Al nanowire (NW) heterostructures are presented, which act as a prototype vehicle toward top-down fabricated nanosheet (NS) and ... » read more

Memory Devices-Based Bayesian Neural Networks For Edge AI
By Technical Paper Link - 20 Dec, 2023 - Comments: 0

A new technical paper titled "Bringing uncertainty quantification to the extreme-edge with memristor-based Bayesian neural networks" was published by researchers at Université Grenoble Alpes, CEA, LETI, and CNRS. Abstract: "Safety-critical sensory applications, like medical diagnosis, demand accurate decisions from limited, noisy data. Bayesian neural networks excel at such tasks, offering... » read more

Technical Paper Roundup: November 28
By Linda Christensen - 28 Nov, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=169 /] More Reading Technical Paper Library home » read more

Chip Industry’s Technical Paper Roundup: May 2
By Linda Christensen - 02 May, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=95 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us p... » read more

Using The Schottky Barrier Transistor in Various Applications & Material Systems
By Technical Paper Link - 30 Apr, 2023 - Comments: 0

A new technical review paper titled "The Schottky barrier transistor in emerging electronic devices" was published by researchers at THM University of Applied Sciences, Chalmers University of Technology, CNRS, University Grenoble Alpes and others. Abstract "This paper explores how the Schottky barrier (SB) transistor is used in a variety of applications and material systems. A discussion of... » read more

Chip Industry’s Technical Paper Roundup: Apr. 18
By Linda Christensen - 18 Apr, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=93 /]   If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involv... » read more

Power Semiconductor Devices: Thermal Management and Packaging
By Technical Paper Link - 10 Apr, 2023 - Comments: 0

A technical paper titled "Thermal management and packaging of wide and ultra-wide bandgap power devices: a review and perspective" was published by researchers at Virginia Polytechnic Institute and State University, U.S. Naval Research Laboratory, and Univ Lyon, CNRS. "This paper provides a timely review of the thermal management of WBG and UWBG power devices with an emphasis on packaged dev... » read more

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