Chip Industry Technical Paper Roundup: August 11

Ultralow-voltage retention SRAM; epitaxial growth for 3D DRAM; 3DIC electromigration in Cu-Cu joints; fine-tuning of spiking Q-networks; optical next-gen reservoir computing; double intra-cavity VCSELs; non-ideal subthreshold swing in CNTs; SystemC-based virtual platforms using FMI.

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New technical papers recently added to Semiconductor Engineering’s library:

Name of Paper Research Organizations
A New Ultralow-Voltage Retention SRAM Cell Enhancing Noise Immunity Tokyo Institute of Technology
Epitaxial growth of up to 120× {Si0.8Ge0.2/Si} bilayers in view of three dimensional dynamic random access memory applications imec, Ghent University
In Situ Atomic-Scale Investigation of Electromigration Behavior in Cu–Cu Joints at High Current Density NYCU, ITRI
Hardware-Aware Fine-Tuning of Spiking Q-Networks on the SpiNNaker2 Neuromorphic Platform TU Dresden, ScaDS.AI, Centre for Tactile Internet with Human-in-the-Loop
Optical next generation reservoir computing Sorbonne, CNRS, Tsinghua University
Thermal Characteristics of a Double Intra-Cavity Contact VCSEL for Cryogenic Optical Links Tampere University
Non-ideal subthreshold swing in aligned carbon nanotube transistors due to variable occupancy discrete charge traps Berkeley Lab, Sandia
FMI Meets SystemC: A Framework for Cross-Tool Virtual Prototyping RWTH Aachen University, MachineWare GmbH, tracetronic GmbH

Find more semiconductor research papers here.



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