Research Bits: Apr. 14


Authentication for edge devices Researchers from the University of Hong Kong, Tsinghua University, and the Southern University of Science and Technology designed a privacy-preserving system for edge devices that combines physically unclonable functions and compute-in-memory. The Co-Located Authentication and Processing (CLAP) system integrates authentication and processing functions within ... » read more

Chip Industry Technical Paper Roundup: August 11


New technical papers recently added to Semiconductor Engineering’s library: [table id=463 /] Find more semiconductor research papers here. » read more

Chip Industry Week in Review


Apple plans to increase its U.S. investment by an additional $100 billion over four years, which includes the launch of an advanced manufacturing supply chain program, spurring a number of related chip industry announcements, including: Apple will invest in Amkor's new packaging and test facility in Arizona as its first and largest customer, and Amkor will package and test Apple silicon pr... » read more

Optical Next-Gen Reservoir Computing Framework (Sorbonne, CNRS, Tsinghua U. et al)


A new technical paper titled "Optical next generation reservoir computing" was published by researchers at Sorbonne Université, CNRS, Tsinghua University, University of Hong Kong, and University of Tokyo. Excerpt "Artificial neural networks with internal dynamics exhibit remarkable capability in processing information. Reservoir computing (RC) is a canonical example that features rich comp... » read more

Overview Of The End-to-End Autonomous Driving through V2X Challenge (Tsinghua, HK Univ., Stanford, TU Munich et al.)


A new technical paper titled "Research Challenges and Progress in the End-to-End V2X Cooperative Autonomous Driving Competition" was published by researchers at Tsinghua University, Hong Kong University, Stanford University, TU Munich, Imperial College of London et al. Abstract "With the rapid advancement of autonomous driving technology, vehicle-to-everything (V2X) communication has emerge... » read more

Many Options For EUV Photoresists, No Clear Winner


In EUV lithography, and especially high-numerical-aperture EUV, balancing tradeoffs between resolution, sensitivity and line-width roughness is becoming increasingly difficult. Lithography patterning using extreme UV exposure depends on a resist mask that can simultaneously meet targets of small feature resolution, high sensitivity to EUV wavelength, and acceptable linewidth roughness. Unfor... » read more

Chip Industry Technical Paper Roundup: Sept. 9


New technical papers recently added to Semiconductor Engineering’s library: [table id=354 /] More ReadingTechnical Paper Library home » read more

Scalable Chiplet System for LLM Training, Finetuning and Reduced DRAM Accesses (Tsinghua University)


A new technical paper titled "Hecaton: Training and Finetuning Large Language Models with Scalable Chiplet Systems" was published by researchers at Tsinghua University. Abstract "Large Language Models (LLMs) have achieved remarkable success in various fields, but their training and finetuning require massive computation and memory, necessitating parallelism which introduces heavy communicat... » read more

Reasons To Know IGZO


Interest in monolithic 3D integration is driven by both compute-in-memory applications and a more general need for increased circuit density. Compute-in-memory architectures seek to reduce the power requirements of machine learning workloads, which are dominated by the movement of data between memory and logic components. Even in conventional architectures, though, placing high-density, high-ba... » read more

Research Bits: April 23


Probabilistic computer prototype Researchers at Tohoku University and the University of California Santa Barbara created a prototype of a heterogeneous probabilistic computer that combines a CMOS circuit with a limited number of stochastic nanomagnets. It aims to improve the execution of probabilistic algorithms used to solve problems where uncertainty is inherent or where an exact solution... » read more

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