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Week In Review: Design, Low Power


Tools & IP MIPS announced its first products based on the RISC-V ISA. The eVocore IP cores are designed to provide a flexible foundation for heterogeneous compute, supporting combinations of eVocore processors as well as other accelerators, with a Coherence Manager that maintains L2 cache and system-level coherency between all cores, main memory, and I/O devices. They target high-performan... » read more

Strategies For Faster Yield Ramps On 5nm Chips


Leading chipmakers TSMC and Samsung are producing 5nm devices in high volume production and TSMC is forging ahead with plans for first 3nm silicon by year end. But to meet such aggressive targets, engineers must identify defects and ramp yield faster than before. Getting a handle on EUV stochastic defects — non-repeating patterning defects such as microbridges, broken lines, or missing con... » read more

Week In Review: Manufacturing, Test


Deals AMD plans to purchase cloud startup Pensando for about US $1.9 billion. In a presentation at the SEMI ISS conference this week, AMD CTO Mark Papermaster described Pensando's technology as a "highly programmable packet-processing engine that allows you to speed up systems designed for the data center." Intel, Micron, Analog Devices and MITRE Engenuity formed an alliance to accelerate c... » read more

Week In Review: Design, Low Power


Tools Synopsys introduced a new model for using its EDA tools on the cloud. Synopsys Cloud provides pay-as-you-go access to the company's cloud-optimized design and verification products, with pre-optimized infrastructure on Microsoft Azure to address higher levels of interdependencies in chip development. "As more design flows incorporate AI, requiring even more resources, the virtually unlim... » read more

Technical Paper Round-Up: March 22


New memories, materials, and transistor types, and processes for making those devices, highlighted the past week's technical papers. That includes everything from vertical MoS2 to programmable black phosphorus image sensors and photonic lift-off processes for flexible thin-film materials. Papers continue to flow from all parts of the supply chain, with some new studies out of Pakistan, Seoul... » read more

Week In Review: Design, Low Power


Tools & IP Imperas Software introduced the RISC-V Verification Interface (RVVI). The open standard and methodology can be adapted to any configuration permitted within the RISC-V specifications. RVVI defines interfaces between RTL, reference model, and testbench for RISC-V design verification, with the aim of making RISC-V processor DV reusable. It supports multi-hart, superscalar, and out... » read more

Week In Review: Design, Low Power


Tools & IP Codasip debuted two new customizable low power embedded RISC-V processor cores. To support embedded AI applications, the L31/L11 cores run Google’s TensorFlowLite for Microcontrollers. Codasip Studio tools can be used to customize for specific system, software, and application requirements. Licensing the CodAL description of a Codasip RISC-V core grants customers a full archit... » read more

Microsphere-assisted, nanospot, non-destructive metrology for semiconductor devices


Abstract "As smaller structures are being increasingly adopted in the semiconductor industry, the performance of memory and logic devices is being continuously improved with innovative 3D integration schemes as well as shrinking and stacking strategies. Owing to the increasing complexity of the design architectures, optical metrology techniques including spectroscopic ellipsometry (SE) and ref... » read more

Week In Review: Design, Low Power


Nvidia again made its case for acquiring Arm to the UK's Competition and Markets Authority (CMA). “Arm is a private for-profit business at a crossroads. After acquiring Arm several years ago, SoftBank increased Arm’s headcount, hoping to spur long-term growth in several markets, including data center and personal computer, long dominated by Intel and x86. SoftBank’s investment phase has c... » read more

Week In Review: Design, Low Power


SK Hynix completed the first phase of its acquisition of Intel's NAND and SSD business. In this first step it took control Intel’s SSD business and the Dalian NAND flash manufacturing facility in China, for a price of $7 billion. Next, it will acquire from Intel the remaining assets in relation to its NAND business, including IP related to the manufacture and design of NAND flash wafers, R&am... » read more

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