Chip Industry Week In Review

By The SE Staff - 12 Jan, 2024 - Comments: 0

By Jesse Allen, Karen Heyman, and Liz Allan Renesas will acquire Transphorm, which designs and manufactures gallium nitride power devices, for about $339 million. GaN, which is a wide-bandgap technology, is used for high-voltage applications in a slew of markets, including EVs and EV fast chargers, as well as data centers and industrial applications. Cadence acquired Invecas, a provider o... » read more

Research Bits: Dec. 18

By Jesse Allen - 18 Dec, 2023 - Comments: 0

Stacking 2D layers for AI processing Researchers from Washington University in St. Louis, MIT, Yonsei University, Inha University, Georgia Institute of Technology, and the University of Notre Dame demonstrated monolithic 3D integration of layered 2D material, creating a novel AI processing hardware that integrates sensing, signal processing, and AI computing functions into a single chip. Th... » read more

Technical Paper Roundup: Sept. 12

By Linda Christensen - 12 Sep, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=51 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit f... » read more

New Processor Fuzzing Mechanism

By Technical Paper Link - 07 Sep, 2022 - Comments: 0

Researchers from Boston University and University of Washington published a technical paper titled "ProcessorFuzz: Guiding Processor Fuzzing using Control and Status Registers." Abstract "As the complexity of modern processors has increased over the years, developing effective verification strategies to identify bugs prior to manufacturing has become critical. Undiscovered micro-architectur... » read more

TAP-2.5D: A Thermally-Aware Chiplet Placement Methodology for 2.5D Systems

By Technical Paper Link - 23 Dec, 2021 - Comments: 0

Abstract "Heterogeneous systems are commonly used today to sustain the historic benefits we have achieved through technology scaling. 2.5D integration technology provides a cost-effective solution for designing heterogeneous systems. The traditional physical design of a 2.5D heterogeneous system closely packs the chiplets to minimize wirelength, but this leads to a thermally-inefficient design... » read more

Power/Performance Bits: Nov. 30

By Jesse Allen - 30 Nov, 2021 - Comments: 0

Universal decoding algorithm Researchers at MIT, Boston University, and Maynooth University built a silicon chip that is able to decode any error-correcting code, regardless of its structure, with maximum accuracy, using a universal decoding algorithm called Guessing Random Additive Noise Decoding (GRAND). Encoded data traveling over a network is susceptible to noise, which disrupts the sig... » read more

Manufacturing Bits: June 2

By Mark LaPedus - 02 Jun, 2020 - Comments: 0

EUV lithography in outer space The U.S. space program made history on May 31, 2020, when NASA astronauts Robert Behnken and Douglas Hurley aboard SpaceX’s Crew Dragon spacecraft arrived at the International Space Station (ISS). This is the first time a commercial spacecraft has delivered astronauts to the ISS. The ISS serves as a research lab for companies, government agencies and universiti... » read more

System Bits: April 23

By Jeff Dorsch - 23 Apr, 2019 - Comments: 0

AI tool can clean up dirty data Researchers at the University of Waterloo, collaborating with colleagues at the University of Wisconsin and Stanford University, came up with HoloClean, an artificial intelligence tool to comb through dirty data and to detect information errors. “More and more machines are making decisions for us, so all our lives are touched by dirty data daily,” said Ih... » read more

Power/Performance Bits: Feb. 19

By Jesse Allen - 19 Feb, 2019 - Comments: 0

Flexible energy harvesting rectenna Researchers from MIT, Universidad Politécnica de Madrid, University Carlos III of Madrid, Boston University, University of Southern California, and the Army Research Laboratory created a flexible rectenna capable of converting energy from Wi-Fi signals into electricity to power small devices and sensors. The device uses a flexible RF antenna to capture e... » read more

System Bits: April 24

By Ann Mutschler - 24 Apr, 2018 - Comments: 0

Some superconductors carry spin currents A few years ago, researchers from the University of Cambridge showed that it was possible to create electron pairs in which the spins are aligned: up-up or down-down. The spin current can be carried by up-up and down-down pairs moving in opposite directions with a net charge current of zero, and the ability to create such a pure spin super-current is an... » read more

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