Chip Industry Technical Paper Roundup: Jun. 2


New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations Physical Foundation Models: Fixed HW implementations of large-scale neural networks 🔗 Yale University, Cornell University, Boston University, NTT Research Understanding Inference Scaling for LLMs: Bottlenecks, Trade-offs, and Performance Princip... » read more

Building Fixed HW Implementations of Neural Networks (Yale, Cornell et al.)


Researchers from Yale University, Cornell University, Boston University, and NTT Research have published “Physical Foundation Models: Fixed hardware implementations of large-scale neural networks”. Abstract "Foundation models are deep neural networks (such as GPT-5, Gemini~3, and Opus~4) trained on large datasets that can perform diverse downstream tasks -- text and code generation, q... » read more

Chip Industry Technical Paper Roundup: Mar. 9


New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations FHECore: Rethinking GPU Microarchitecture for Fully Homomorphic Encryption 🔗 Boston University, Northeastern University, KAIST, University of Murcia Heterogeneous Memory Design Exploration for AI Accelerators with a Gain Cell Memory Compiler ... » read more

A GPU Microarchitecture Optimized for Fully Homomorphic Encryption


Researchers from Boston University, Northeastern University, KAIST, and University of Murcia, et al. have released “FHECore: Rethinking GPU Microarchitecture for Fully Homomorphic Encryption”. Abstract“Fully Homomorphic Encryption (FHE) enables computation directly on encrypted data but incurs massive computational and memory overheads, often exceeding plaintext execution by seve... » read more

Chip Industry Week In Review


Big Deals and Fundings Rapidus secured US$1.7B in a new funding round from the Japanese government and the private sector to ramp 2nm production by next year. Open AI announced a $110B in new funding, with $30B from Nvidia, $30B from Softbank and $50B from Amazon. In a $100B multi-year deal, Meta will power its AI infrastructure with up to 6GW of AMD's GPUs. SambaNova and Intel ar... » read more

Chip Industry Technical Paper Roundup: Dec. 16


New technical papers recently added to Semiconductor Engineering’s library: [table id=501 /] Find more semiconductor research papers here and in the most recent Chip Industry Week in Review. » read more

Photonic Chip With A 2D Programmable Waveguide (Boston U., UC Irvine, Yale)


A new technical paper titled "Arbitrary control over multimode wave propagation for machine learning" was published by researchers at Boston University, UC Irvine, and Yale University. Abstract "Controlled multimode wave propagation can enable more space-efficient photonic processors than architectures based on discrete components connected by single-mode waveguides. Instead of defining d... » read more

Chip Industry Technical Paper Roundup: Oct. 28


New technical papers recently added to Semiconductor Engineering’s library: [table id=486 /] Find more semiconductor research papers here. » read more

Photonics as a Carbon-Sustainable Solution for Next-Gen AI Hardware (Boston Univ., NY CREATES, Lightmatter, Cornell Tech)


A new technical paper titled "Photonics for sustainable AI" was published by researchers at Boston University, NY CREATES, Lightmatter and Cornell Tech. Abstract "The rising computational demands of Artificial Intelligence (AI) are driving a rapid surge in carbon emissions from the Information and Communications Technology (ICT) sector. Traditional CMOS-based computing is reaching its scali... » read more

Research Bits: August 19


Co-packaged optics Researchers from the Massachusetts Institute of Technology (MIT) and Bridgewater State University developed a new way to co-package photonic and electronic chips that uses existing automated pick-and-place assembly equipment in traditional fabs along with a less-expensive passive alignment process. “We’ve developed a packaging design [for integrating photonics with el... » read more

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