tag: Argonne National Laboratory

Chip Industry Week In Review
By The SE Staff - 04 Oct, 2024 - Comments: 0

Amkor will provide turnkey advanced packaging and test services to TSMC in Amkor's planned facility in Peoria, Arizona, in a deal announced on Thursday. The companies jointly specified the packaging technologies, such as TSMC’s Integrated Fan-Out (InFO) and Chip on Wafer on Substrate (CoWoS). President Biden signed into law a bill that exempts some semiconductor projects funded by the U.S.... » read more

Chip Industry Week In Review
By The SE Staff - 27 Sep, 2024 - Comments: 0

Global spending on 300mm fab equipment is expected to reach a record US$400 billion from 2025 to 2027, according to SEMI. Key drivers are the regionalization of semiconductor fabs and the increasing demand for AI chips in data centers and edge devices, with China, South Korea, and Taiwan leading the way. The Biden-Harris Administration launched the National Semiconductor Technology Center’... » read more

Chip Industry Week In Review
By The SE Staff - 06 Sep, 2024 - Comments: 0

Concerns mount on the use of American-manufactured semiconductors in Russian weapons, with Analog Devices, AMD, Intel and TI set to testify next week before the U.S. Senate Permanent Subcommittee on Investigations. Also, U.S. and other government agencies issued a joint advisory and more details about ongoing Russian military cyberattacks, espionage, and sabotage. The U.S. Commerce Departmen... » read more

Chip Industry Week In Review
By The SE Staff - 09 Aug, 2024 - Comments: 0

Three Fraunhofer Institutes (IIS/EAS, IZM, and ENAS) launched the Chiplet Center of Excellence, a research initiative to support the commercial introduction of chiplet technology. The center initially will focus on automotive electronics, developing workflows and methods for electronics design, demonstrator construction, and the evaluation of reliability. The UCIe Consortium published the Un... » read more

Research Bits: Aug. 5
By Jesse Allen - 05 Aug, 2024 - Comments: 0

Measuring temperature with neutrons Researchers from Osaka University, National Institutes for Quantum Science and Technology, Hokkaido University, Japan Atomic Energy Agency, and Tokamak Energy developed a way to rapidly measure the temperature of electronic components inside a device using neutrons. The technique, called ‘neutron resonance absorption’ (NRA), examines neutrons being ab... » read more

Chip Industry Week In Review
By The SE Staff - 26 Jul, 2024 - Comments: 0

The U.S. Department of Commerce and Amkor Technology signed a deal to provide up to $400 million in funding, under the CHIPS and Science Act, to build a previously announced end-to-end advanced packaging plant. The combined funding is expected to total about $2 billion. The new facility will add some 2,000 jobs in Peoria, Arizona. The SK hynix Board approved its Yongin Semiconductor Cluster... » read more

Sidestepping Lithography In Chip Manufacturing
By Katherine Derbyshire - 23 May, 2024 - Comments: 0

Rising lithography costs, shrinking feature sizes, and the need for an alternative to copper are collectively spurring new interest in area-selective deposition. An extension of atomic layer deposition, ASD seeks to build circuit features from the bottom up, without relying on lithography. Lithography will remain a critical tool for the foreseeable future. But it has long been the most expen... » read more

Chip Industry Week In Review
By The SE Staff - 03 May, 2024 - Comments: 0

Samsung and Synopsys collaborated on the first production tapeout of a high-performance mobile SoC design, including CPUs and GPUs, using the Synopsys.ai EDA suite on Samsung Foundry's gate-all-around (GAA) process. Samsung plans to begin mass production of 2nm process GAA chips in 2025, reports BusinessKorea. UMC developed the first radio frequency silicon on insulator (RF-SOI)-based 3D IC ... » read more

Chip Industry Week In Review
By The SE Staff - 26 Apr, 2024 - Comments: 0

President Biden announced four new Workforce Hubs to support the CHIPS Act and other initiatives, in Upstate New York, Michigan, Milwaukee, and Philadelphia. The White House also provided economic context and progress updates for the President’s workforce strategy. Samsung began mass production of its ninth-gen industry-first V-NAND chip. Along with one-terabit triple-level cell design, th... » read more

Enabling Advanced Devices With Atomic Layer Processes
By Katherine Derbyshire - 18 Apr, 2024 - Comments: 2

Atomic layer deposition (ALD) used to be considered too slow to be of practical use in semiconductor manufacturing, but it has emerged as a critical tool for both transistor and interconnect fabrication at the most advanced nodes. ALD can be speeded up somewhat, but the real shift is the rising value of precise composition and thickness control at the most advanced nodes, which makes the ext... » read more

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