Chip Industry Technical Paper Roundup: May 26

SRAM-based LLM inference; semantics-aware memory hierarchy for LLM reasoning; large-scale 2D material transfer; RISC-V vector performance portability; morphological mask optimization; trustworthy GenAI for automotive systems; HW-native GPU compilers for ML production.

popularity

New technical papers recently added to Semiconductor Engineering’s library:

Technical Paper Research Organizations
SHIP: SRAM-Based Huge Inference Pipelines for Fast LLM Serving 🔗 Nvidia, Groq
Not All Thoughts Need HBM: Semantics-Aware Memory Hierarchy for LLM Reasoning 🔗 USC, University of Wisconsin-Madison
Water-based, large-scale transfer of 2D materials grown on sapphire substrates 🔗 AMO GmbH, RWTH Aachen University, Aixtron SE
Closer in the Gap: Towards Portable Performance on RISC-V Vector Processors 🔗 KTH Royal Institute of Technology, Lawrence Livermore National Laboratory, Barcelona Supercomputing Center
MorphOPC: Advancing Mask Optimization with Multi-scale Hierarchical Morphological Learning 🔗 University at Buffalo, Villanova University, IBM T. J. Watson Research Center
Workflow-Level Design Principles for Trustworthy GenAI in Automotive System Engineering 🔗 University of Oldenburg, Denso Automotive
TLX: Hardware-Native, Evolvable MIMW GPU Compiler for Large-scale Production Environments 🔗 UC San Diego, Meta

Find more semiconductor research papers here.

 



Leave a Reply


(Note: This name will be displayed publicly)