Chip Industry Technical Paper Roundup: May 26


New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations SHIP: SRAM-Based Huge Inference Pipelines for Fast LLM Serving 🔗 Nvidia, Groq Not All Thoughts Need HBM: Semantics-Aware Memory Hierarchy for LLM Reasoning 🔗 USC, University of Wisconsin-Madison Water-based, large-scale transfer of... » read more

Scalable Photomask Optimization With Morphological Learning (SUNY Buffalo, VU, IBM)


A new technical paper, "MorphOPC: Advancing Mask Optimization with Multi-scale Hierarchical Morphological Learning," was published by researchers at University at Buffalo, Villanova University, and IBM T. J. Watson Research Center. Abstract "As feature sizes shrink to the nanometer scale, accurately transferring circuit patterns from photomasks to silicon wafers becomes increasingly chall... » read more

Research Bits: Feb. 18


Predicting band gap with neural networks Researchers from Kyoto University developed a machine learning model to predict the band gap of novel semiconductor materials. Using data from almost 2,000 semiconductor materials, the team tested six different neural networks. They found that the incorporation of conditional generative adversarial networks (CGAN) and message passing neural networks ... » read more

Research Bits: August 29


Resistive switching with hafnium oxide Researchers from the University of Cambridge, Purdue University, University College London, Los Alamos National Laboratory, and University at Buffalo used hafnium oxide to build a resistive switching memory device that processes data in a similar way as the synapses in the human brain. At the atomic level, hafnium oxide has no structure, with the hafni... » read more

Chip Industry’s Technical Paper Roundup: July 5


New technical papers recently added to Semiconductor Engineering’s library: [table id=114 /] (more…) » read more

Resistive Switching Memory Based on Thin-Film Design of Amorphous Hafnium Oxide (Cambridge & Others)


A technical paper titled “Thin-film design of amorphous hafnium oxide nanocomposites enabling strong interfacial resistive switching uniformity” was published by researchers at University of Cambridge, Linköping University, Purdue University, University College London, Los Alamos National Laboratory, and University at Buffalo. Abstract: "A design concept of phase-separated amorphous nano... » read more

Research Bits: Aug. 8


Speeding NVM encryption Researchers from North Carolina State University propose a way to speed up encryption and file system performance for non-volatile memory (NVM). “NVMs are an emerging technology that allows rapid access to the data, and retains data even when a system crashes or loses power,” said Amro Awad, an assistant professor of electrical and computer engineering at North C... » read more

Power/Performance Bits: Oct. 15


Probabilistic computing Researchers at Purdue University and Tohoku University built a hardware demonstration of a probabilistic computer utilizing p-bits to perform quantum computer-like calculations. The team says probabilistic computing could bridge the gap between classical and quantum computing and more efficiently solve problems in areas such as drug research, encryption and cybersecurit... » read more

Power/Performance Bits: Sept. 4


Preventing battery fires Researchers from Oak Ridge National Laboratory and the University of Rochester developed a method to prevent lithium-ion batteries from catching on fire when damaged. "In a lithium-ion battery, a thin piece of plastic separates the two electrodes," said Gabriel Veith, a research lead at ORNL. "If the battery is damaged and the plastic layer fails, the electrodes can... » read more

Power/Performance Bits: Feb. 27


Encryption chip A team at MIT developed a new chip to lower the power consumption of public-key cryptography for IoT devices. Software execution of encryption protocols require more energy and memory space than embedded IoT sensors can typically spare, given the need to maximize battery life. The new chip is hardwired to perform public-key encryption and consumes only 1/400 as much power as... » read more

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