Chip Industry Technical Paper Roundup: May 26


New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations SHIP: SRAM-Based Huge Inference Pipelines for Fast LLM Serving 🔗 Nvidia, Groq Not All Thoughts Need HBM: Semantics-Aware Memory Hierarchy for LLM Reasoning 🔗 USC, University of Wisconsin-Madison Water-based, large-scale transfer of... » read more

HW-Native, GPU Compiler for Large-scale ML Production Systems (UC San Diego, Meta)


A new technical paper, "TLX: Hardware-Native, Evolvable MIMW GPU Compiler for Large-scale Production Environments," was published by researchers at UC San Diego and Meta. Abstract "Modern GPUs increasingly rely on specialized hardware units and asynchronous coordination mechanisms, so performance depends on orchestrating data movement, tensor-core computation, and synchronization rather t... » read more

Chip Industry Technical Paper Roundup: May 11


New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations Source-position-dependent transmission cross coefficient formula including polarization and mask three-dimensional effects in High NA EUV🔗 Science Tokyo Performance and Energy Benefits of MRDIMMs 🔗 Barcelona Supercomputing Center, UPC, ... » read more

Chip Industry Technical Paper Roundup: Mar. 24


New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations NL2GDS: LLM-aided interface for Open Source Chip Design 🔗 University of Bristol, Rutherford Appleton Laboratory An Integrated Failure and Threat Mode and Effect Analysis (FTMEA) Framework with Quantified Cross-Domain Correlation Factors for Automot... » read more

Chip Industry Week In Review


Disruptions caused by the Iran conflict have taken about one third of the global helium supply off the market, an essential gas for semiconductor manufacturing, reports the World Economic Forum. Other potential impacts for the chip industry include bromine and other chemical shortages, logistical disruptions, and higher energy prices incurred by fabs in Asia. Top Deals IBM and Lam R... » read more

Chip Industry Technical Paper Roundup: Feb. 24


New technical papers recently added to Semiconductor Engineering’s library: [table id=525 /] Find more semiconductor research papers here. » read more

Chip Industry Technical Paper Roundup: Oct. 21


New technical papers recently added to Semiconductor Engineering’s library: [table id=484 /] Find more semiconductor research papers here. » read more

Chip Industry Week in Review


Apple plans to increase its U.S. investment by an additional $100 billion over four years, which includes the launch of an advanced manufacturing supply chain program, spurring a number of related chip industry announcements, including: Apple will invest in Amkor's new packaging and test facility in Arizona as its first and largest customer, and Amkor will package and test Apple silicon pr... » read more

Chip Industry Week in Review


The U.S. government will grant licenses to NVIDIA and AMD to again sell some AI chips — NVIDIA's H20 GPU and AMD's MI308 — to Chinese companies. TrendForce projects that the availability of NVIDIA chips, in particular, will create a surge in demand from Chinese AI firms and cloud service providers, and boost high-bandwidth memory (HBM) consumption. The move could raise China’s share of... » read more

HW Security: A Hybrid Verification Method Combining Simulation And Formal Verification (RPTU, UCSD)


A new technical paper titled "FastPath: A Hybrid Approach for Efficient Hardware Security Verification" was published by researchers at RPTU Kaiserslautern-Landau and UC San Diego. "We propose FastPath, a hybrid verification methodology that combines the efficiency of simulation with the exhaustive nature of formal verification. FastPath employs a structural analysis framework to automate th... » read more

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