Chip Industry Technical Paper Roundup: Apr. 21

Neural computers; AFM on EUV nanostructures; photonic chip packaging; extreme-environment photonics; SSD emulation for GPU-centric storage; ruthenium interconnects; DRAM power delivery on CIM; silent data corruption; LLM training reliability; GPU Rowhammer; privilege escalation.

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New technical papers recently added to Semiconductor Engineering’s library:

Technical Paper Research Organizations
Neural Computers 🔗 Meta AI, KAUST
Characterizing tip-sample interaction dynamics on EUV nanostructures using AFM with a high-aspect ratio tip 🔗 Purdue University, Intel, Bruker 
Photonic chip packaging for extreme environments 🔗 NIST, Johns Hopkins, U. of Maryland
SwarmIO: Towards 100 Million IOPS SSD Emulation for Next-gen GPU-centric Storage Systems 🔗 KAIST
Role of surface states and band modulations in ultrathin ruthenium interconnects 🔗 Incheon National U., Hanyang University, UT Dallas
A comparative study on power delivery aspects of compute-in/near-memory approaches using DRAM 🔗 UT Austin
Exploring Silent Data Corruption as a Reliability Challenge in LLM Training 🔗 TU Berlin
GPUBreach: Privilege Escalation Attacks via GPU Rowhammer 🔗 University of Toronto

Find more semiconductor research papers here.

 



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