tag: University of Toronto

Chip Industry Technical Paper Roundup: July 16
By Linda Christensen - 16 Jul, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library. [table id=244 /] More ReadingTechnical Paper Library home   » read more

Finely Tuning The Electronic Band Structure of WSe2 With AFM
By Technical Paper Link - 08 Jul, 2024 - Comments: 0

A technical paper titled “Strain Driven Electrical Bandgap Tuning of Atomically Thin WSe2” was published by researchers at University of Toronto, University of Tokyo,  and Stanford University. Abstract: "Tuning electrical properties of 2D materials through mechanical strain has predominantly focused on n-type 2D materials like MoS2 and WS2, while p-type 2D materials such as WSe2 remain... » read more

Chip Industry Week In Review
By The SE Staff - 21 Jun, 2024 - Comments: 0

BAE Systems and GlobalFoundries are teaming up to strengthen the supply of chips for national security programs, aligning technology roadmaps and collaborating on innovation and manufacturing. Focus areas include advanced packaging, GaN-on-silicon chips, silicon photonics, and advanced technology process development. Onsemi plans to build a $2 billion silicon carbide production plant in the ... » read more

Chip Industry’s Technical Paper Roundup: October 31
By Liz Allan - 31 Oct, 2023 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=159 /] More Reading Technical Paper Library home » read more

Optimization Of The Interface Between The PD And The AFE In High-Speed, High-Density Optical Receivers
By Technical Paper Link - 27 Oct, 2023 - Comments: 0

A technical paper titled “Optimizing the Photodetector/Analog Front-End Interface in Optical Communication Receivers” was published by researchers at University of Toronto. Abstract: "This article addresses the optimization of the interface between the photodetector (PD) and the analog front-end in high-speed, high-density optical communication receivers. Specifically, the article focuses... » read more

Chip Industry’s Technical Paper Roundup: July 24
By Liz Allan - 24 Jul, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=119 /] More Reading Technical Paper Library home » read more

A Flip-Chip, Co-Packaged With Photodiode, High-speed TIA in 16nm FinFET CMOS
By Technical Paper Link - 20 Jul, 2023 - Comments: 0

A technical paper titled "A 112-Gb/s —8.2-dBm Sensitivity 4-PAM Linear TIA in 16-nm CMOS With Co-Packaged Photodiodes" was published by researchers at University of Toronto, Alphawave IP, and Huawei Technologies Canada. Abstract: "A flip-chip co-packaged linear transimpedance amplifier (TIA) in 16-nm fin field effect transistor (FinFET) CMOS demonstrating 112-Gb/s four-level pulse-amplitude... » read more

Chip Industry’s Technical Paper Roundup: May 2
By Linda Christensen - 02 May, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=95 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us p... » read more

Overview Of EV Charging Infrastructure, The Role of Power Electronics, And Charging Technologies
By Technical Paper Link - 26 Apr, 2023 - Comments: 0

A technical paper titled "Charging Infrastructure and Grid Integration for Electromobility" was published by researchers at Universidad de los Andes, University of Cambridge, Duke University, Universidad Técnica Federico Santa Maria, University of Toronto, TU Delft, and University of Florence. Abstract "Electric vehicle (EV) charging infrastructure will play a critical role in decarbonizat... » read more

Chip Industry’s Technical Paper Roundup: Mar. 21
By Linda Christensen - 21 Mar, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=88 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us ... » read more

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