tag: University of Toronto

FPGA-based Infrastructure, With RISC-V Prototype, to Enable Implementation & Evaluation of Cross-Layer Techniques in Real HW (Best Paper Award)
By Technical Paper Link - 15 Mar, 2023 - Comments: 0

A technical paper titled "MetaSys: A Practical Open-Source Metadata Management System to Implement and Evaluate Cross-Layer Optimizations" was published by researchers at University of Toronto, ETH Zurich, and Carnegie Mellon University. This paper won the Best Paper Award at the HiPEAC 2023 conference. Abstract: "This paper introduces the first open-source FPGA-based infrastructure, MetaSy... » read more

Chip Industry’s Technical Paper Roundup: Oct 25
By Linda Christensen - 25 Oct, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=59 /] » read more

Redesigning Core and Cache Hierarchy For A General-Purpose Monolithic 3D System
By Technical Paper Link - 24 Oct, 2022 - Comments: 0

A technical paper titled "RevaMp3D: Architecting the Processor Core and Cache Hierarchy for Systems with Monolithically-Integrated Logic and Memory" was published by researchers at ETH Zürich, KMUTNB, NTUA, and University of Toronto. Abstract: "Recent nano-technological advances enable the Monolithic 3D (M3D) integration of multiple memory and logic layers in a single chip with fine-graine... » read more

Week In Review: Auto, Security, Pervasive Computing
By Marie C. Baca - 09 Sep, 2022 - Comments: 0

Automotive and mobility Seventeen U.S. states must decide whether or not to follow California's new law that mandates that all new cars, pickups and SUVs be electric or hydrogen-powered by 2035. The Clean Air Act dictates that states must follow federal guidelines unless they follow certain components of California's rules. A research firm says consumers are most passionate about a high-tec... » read more

Technical Paper Roundup: Sept 6
By Linda Christensen - 06 Sep, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=49 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit f... » read more

Vulnerability of Neural Networks Deployed As Black Boxes Across Accelerated HW Through Electromagnetic Side Channels
By Technical Paper Link - 05 Sep, 2022 - Comments: 0

This technical paper titled "Can one hear the shape of a neural network?: Snooping the GPU via Magnetic Side Channel" was presented by researchers at Columbia University, Adobe Research and University of Toronto at the 31st USENIX Security Symposium in August 2022. Abstract: "Neural network applications have become popular in both enterprise and personal settings. Network solutions are tune... » read more

QUAC-TRNG: High-Throughput True Random Number Generation Using Quadruple Row Activation in Commodity DRAM Chips
By Technical Paper Link - 18 Nov, 2021 - Comments: 0

Abstract "True random number generators (TRNG) sample random physical processes to create large amounts of random numbers for various use cases, including security-critical cryptographic primitives, scientific simulations, machine learning applications, and even recreational entertainment. Unfortunately, not every computing system is equipped with dedicated TRNG hardware, limiting the applicat... » read more

Multicolored Nanocolloidal Hydrogel Inks For Anti-Counterfeiting
By Technical Paper Link - 11 Oct, 2021 - Comments: 0

Abstract "Nanocolloidal gels are emerging as a promising class of materials with applications as inks in 2D and 3D printing. Polymer nanoparticles (NPs) offer many advantages as potential building blocks of nanocolloidal gels, due to the ability to control NP dimensions, charge, surface chemistry, and functionality; however, their applications as inks in printing are yet to be explored. Here, ... » read more

Manufacturing Bits: Oct. 11
By Mark LaPedus - 11 Oct, 2021 - Comments: 0

IC security using AFMs The National Institute of Standards and Technology (NIST) has developed a probe assisted doping technique (PAD), a technology that could help prevent counterfeit chips and electronic devices from entering the market. PAD involves creating a unique ID tag on every chip using an atomic force microscope (AFM). Basically, an AFM system incorporates a cantilever with a tin... » read more

Automotive Lidar Technologies Battle It Out
By Bryon Moyer - 05 Aug, 2021 - Comments: 1

Lidar is likely to be added to the list of sensors that future cars will use to help with navigation and safety, but most likely it won't be the large rotating mirror assembly on the top of vehicles. Newer solid-state radar technologies are being researched and developed, although it’s not yet clear which of these will win. “The benefits of lidar technology are well known dating back to ... » read more

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