Chip Industry Week In Review

By The SE Staff - 26 Jul, 2024 - Comments: 0

The U.S. Department of Commerce and Amkor Technology signed a deal to provide up to $400 million in funding, under the CHIPS and Science Act, to build a previously announced end-to-end advanced packaging plant. The combined funding is expected to total about $2 billion. The new facility will add some 2,000 jobs in Peoria, Arizona. The SK hynix Board approved its Yongin Semiconductor Cluster... » read more

Chip Industry Technical Paper Roundup: July 8

By Linda Christensen - 08 Jul, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library. [table id=238 /] More ReadingTechnical Paper Library home » read more

CHIPS For America’s National Semiconductor Technology Center (NSTC) Program

By Barry Pangrle - 03 Jul, 2024 - Comments: 0

At this year’s Design Automation Conference, Jay Lewis, director of CHIPS for America National Semiconductor Technology Center (NSTC) Program, gave a presentation on the status and direction of the Center, its priorities for this year and how the NSTC can change the long-term trajectory for innovation. Fig. 1: Dr. Jay Lewis, director of NSTC Program, CHIPS R&D Office at the Dept. o... » read more

New Way To Transmit Light Signals Through A Chip (NIST)

By Technical Paper Link - 26 Jun, 2024 - Comments: 0

A technical paper titled “Bound-state-in-continuum guided modes in a multilayer electro-optically active photonic integrated circuit platform” was published by researchers at the National Institute of Standards and Technology (NIST), University of Maryland, and Theiss Research. Abstract: "In many physical systems, the interaction with an open environment leads to energy dissipation and re... » read more

Chip Industry Week In Review

By The SE Staff - 14 Jun, 2024 - Comments: 0

Samsung unveiled its latest 2nm and 4nm process nodes, plus its AI solutions during the Samsung Foundry Forum. The company also introduced an aggressive roadmap for the next few years that includes 3D-ICs with logic-on-logic, starting in 2025; custom HBM with built-in logic; backside power delivery on 2nm technology in 2027; and co-packaged optics. In presentations at the event, the company als... » read more

Chip Industry Week In Review

By The SE Staff - 17 May, 2024 - Comments: 0

President Biden will raise the tariff rate on Chinese semiconductors from 25% to 50% by 2025, among other measures to protect U.S. businesses from China’s trade practices. Also, as part of President Biden’s AI Executive Order, the Administration released steps to protect workers from AI risks, including human oversight of systems and transparency about what systems are being used. Intel ... » read more

Chip Industry Technical Paper Roundup: May 7

By Liz Allan - 07 May, 2024 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=223 /] More ReadingTechnical Paper Library home » read more

Metrology For 2D Materials: A Review From The International Roadmap For Devices And Systems (NIST, Et Al.)

By Technical Paper Link - 30 Apr, 2024 - Comments: 0

A technical paper titled “Metrology for 2D materials: a perspective review from the international roadmap for devices and systems” was published by researchers at Arizona State University, IBM Research, Unity-SC, and the National Institute of Standards and Technology (NIST). Abstract: "The International Roadmap for Devices and Systems (IRDS) predicts the integration of 2D materials into h... » read more

Chip Industry Week In Review

By The SE Staff - 05 Apr, 2024 - Comments: 0

By Jesse Allen, Gregory Haley, and Liz Allan. The Japanese government approved $3.9 billion in funding for chipmaker Rapidus to expand its foundry business, of which 10% will be invested in advanced packaging. This is in addition to the previously announced $2.18 billion in funding. In a meeting next week, the U.S. and Japan are expected to cooperate on increasing semiconductor development a... » read more

Quantum Computing Challenged By Security, Error Correction

By Karen Heyman - 04 Apr, 2024 - Comments: 0

The number and volume of warnings about a post-quantum cryptography (PQC) world are rising, as governments, banks, and other entities prepare for a rash of compromised data and untrustworthy digital signatures. Exactly when this will become a genuine threat is still somewhat fuzzy, because it depends on progress in developing robust qubits. A report by McKinsey & Co. estimates that by 20... » read more

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tag: NIST

Chip Industry Week In Review

Chip Industry Technical Paper Roundup: July 8

CHIPS For America’s National Semiconductor Technology Center (NSTC) Program

New Way To Transmit Light Signals Through A Chip (NIST)

Chip Industry Week In Review

Chip Industry Week In Review

Chip Industry Technical Paper Roundup: May 7

Metrology For 2D Materials: A Review From The International Roadmap For Devices And Systems (NIST, Et Al.)

Chip Industry Week In Review

Quantum Computing Challenged By Security, Error Correction

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