Chip Industry Technical Paper Roundup: Apr. 21


New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations Neural Computers 🔗 Meta AI, KAUST Characterizing tip-sample interaction dynamics on EUV nanostructures using AFM with a high-aspect ratio tip 🔗 Purdue University, Intel, Bruker  Photonic chip packaging for extreme environments ὑ... » read more

Chip Industry Week In Review


Acquisitions and business pivots Teradyne acquired Israel-based TestInsight, a semiconductor test provider with pattern conversion, validation, and virtual test capabilities. Credo plans to acquire DustPhotonics, a developer of silicon photonics PICs for optical transceivers. Molex plans to acquire Teramount, a provider of detachable, passive-alignment fiber-to-chip connectivity solu... » read more

Photonic Packaging Resistant to Extreme Environments (NIST, Johns Hopkins, U. Of Maryland)


A new technical paper, "Photonic chip packaging for extreme environments" was published by NIST, Johns Hopkins and University of Maryland. Abstract "Integrated photonic sensors have advanced significantly in the past decade for an ever-increasing range of applications, driven by the inherent scalability of integrated photonics combined with the precision of nanofabrication. Robust and rug... » read more

Chip Industry Week In Review


Deals IBM and Arm are collaborating on a new dual‑architecture hardware aimed at enterprise AI and data-intensive workloads, using virtualization to boost reliability, security, scalability, and software compatibility. The goal, according to an IBM spokesperson, is to deliver side-by-side deployments of S390x-Linux and Arm-Linux virtual machines in a single kernel-based hypervisor. Nv... » read more

Research Bits: Mar. 31


2D hard mask material Researchers from Penn State University and University of Chemistry and Technology Prague propose using the 2D material chromium oxychloride (CrOCl) as a hard mask, because its layered structure is resistant to plasma etching and enables it to be an effective mask at smaller thicknesses. “This 2D material is like lasagna. It’s a layer-by-layer structure,” said Zih... » read more

Chip Industry Week in Review


The IEEE ISSCC conference was held this week in San Francisco. Among the highlights: IBM detailed an AI accelerator based on its new inferencing dataflow architecture. CEA-Leti presented a chip-scale, ultra-fast, battery-operated EPR spectrometer. QuTech introduced a cryo-CMOS SoC with NV centers in diamond. UTokyo showed its low-jitter PLL architecture for beyond 5G/6G. Imec d... » read more

Chip Industry Week In Review


Geopolitics U.S. lawmakers are urging tighter export controls on advanced semiconductor manufacturing equipment (SME) to China, warning existing loopholes threaten national security. "China is working to build domestic SME by exploiting access to U.S. and allied subcomponents required to produce tools," states the letter, which also says better coordination with allies is essential. The U.S.... » read more

Chip Industry Week in Review


SIA's latest monthly global semiconductor sales report reflects a ~30% YOY increase, hitting a record $75.3B in November 2025. Asia Pacific had a notable 66% increase. Cadence launched its Chiplet Spec-to-Packaged Parts ecosystem to accelerate time to market for chiplet development for physical AI, data centers, and HPC applications. Initial IP partners joining Cadence include Arm, Arteris, ... » read more

Navigating FIPS 140-3


FIPS 140‑3 is a U.S. federal standard. Validations are issued under the Cryptographic Module Validation Program (CMVP), jointly managed by the National Institute of Standards (NIST) and the Canadian Center for Cyber Security (CCCS). These validations are accepted by both U.S. and Canadian federal agencies. The standard imposes strict requirements on security boundaries, operational environmen... » read more

Chip Industry Technical Paper Roundup: Dec 30


New technical papers recently added to Semiconductor Engineering’s library: [table id=509 /] Find more semiconductor research papers here. » read more

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