Chip Industry Technical Paper Roundup: Apr. 21


New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations Neural Computers 🔗 Meta AI, KAUST Characterizing tip-sample interaction dynamics on EUV nanostructures using AFM with a high-aspect ratio tip 🔗 Purdue University, Intel, Bruker  Photonic chip packaging for extreme environments ὑ... » read more

Impact of Surface States And Band Modulations in Ruthenium Interconnects (Incheon, Hanyang, UT Dallas)


A new technical paper, "Role of surface states and band modulations in ultrathin ruthenium interconnects," was published by researchers at Incheon National University, Hanyang University and UT Dallas. Abstract "Mitigating the RC delay from transistor miniaturization is essential for next-generation devices, driving a focus on interconnect electrical performance. Current copper-based inte... » read more