Chip Industry Technical Paper Roundup: May 19


New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations Micro-Transfer Printing on Silicon Photonics: Tutorial, Recent Progress and Outlook 🔗 Ghent U., imec Challenges and prospects of 2D electronics for future monolithic CFETs 🔗 SKKU, Hanyang U. et al. A Device-Physics-Informed Artific... » read more

A Comprehensive Study Of Integrating 2D Materials With CFET Architecture (SKKU, et al.)


A new technical paper, "Challenges and prospects of 2D electronics for future monolithic complementary field-effect transistors," was published by researchers at Sungkyunkwan University, Hanyang University, Istituto Italiano di Tecnologia, Shanghai University, Jeonbuk National University, and Kyonggi University. Abstract "With planar complementary metal-oxide-semiconductor (CMOS) scaling ... » read more

HW-Based Image Generation Using FTJs (SNU, Sungkyunkwan U., SK hynix et al.)


A new technical paper, "CMOS-compatible ferroelectric tunnel junctions integrate stochastic sampling and deterministic computing for image generation," was published by researchers at Seoul National University, Sungkyunkwan University, Hanyang University, Sogang University, and SK Hynix. Abstract "Recent progress in generative modeling has intensified the need for compact, energy-efficien... » read more

Chip Industry Technical Paper Roundup: Apr. 21


New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations Neural Computers 🔗 Meta AI, KAUST Characterizing tip-sample interaction dynamics on EUV nanostructures using AFM with a high-aspect ratio tip 🔗 Purdue University, Intel, Bruker  Photonic chip packaging for extreme environments ὑ... » read more

Silicon Photonics Lights The Way To More Efficient Data Centers


Key Takeaways Photonic interconnects potentially increase bandwidth density while significantly reducing power consumption. AI workloads are driving their adoption in data centers. On the other hand, photonic interconnects require a variety of different materials, introducing process compatibility and thermal and mechanical stress issues. Integrated electro-optical I/O modules are th... » read more

Impact of Surface States And Band Modulations in Ruthenium Interconnects (Incheon, Hanyang, UT Dallas)


A new technical paper, "Role of surface states and band modulations in ultrathin ruthenium interconnects," was published by researchers at Incheon National University, Hanyang University and UT Dallas. Abstract "Mitigating the RC delay from transistor miniaturization is essential for next-generation devices, driving a focus on interconnect electrical performance. Current copper-based inte... » read more

Chip Industry Technical Paper Roundup: Mar. 3


New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations AutoGNN: End-to-End Hardware-Driven Graph Preprocessing for Enhanced GNN Performance 🔗 KAIST, Panmnesia, Peking University, Hanyang University, Pennsylvania State University Sputtering-driven formation of interstitial oxygen for intrinsic NIR detec... » read more

An FPGA-based Accelerator Addressing Bottlenecks in GNN Preprocessing (KAIST et al.)


A new technical paper "AutoGNN: End-to-End Hardware-Driven Graph Preprocessing for Enhanced GNN Performance" was published by researchers at KAIST, Panmnesia, Peking University, Hanyang University, and Pennsylvania State University. Abstract "Graph neural network (GNN) inference faces significant bottlenecks in preprocessing, which often dominate overall inference latency. We introduce Au... » read more

Chip Industry Technical Paper Roundup: Feb. 3


New technical papers recently added to Semiconductor Engineering’s library: [table id=519 /] Find more semiconductor research papers here. » read more

Overview of ALD-Driven Oxide Semiconductors for High Density, Low Power Memory Architectures (Hanyang Univ., imec)


A new technical paper titled "Oxide Semiconductor for Advanced Memory Architectures: Atomic Layer Deposition, Key Requirement and Challenges" was published by researchers a Hanyang University and imec. Abstract "Oxide semiconductors (OSs), introduced by the Hosono group in the early 2000s, have evolved from display backplane materials to promising candidates for advanced memory and logic ... » read more

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