Chip Industry Technical Paper Roundup: May 19

Micro-transfer printing for silicon photonics; 2D electronics for CFETs; ANN thermal-aware GAA FET modeling; optical phased arrays; ferroelectric tunnel junctions for image generation; functional safety and PPA evaluation.

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New technical papers recently added to Semiconductor Engineering’s library:

Technical Paper Research Organizations
Micro-Transfer Printing on Silicon Photonics: Tutorial, Recent Progress and Outlook 🔗 Ghent U., imec
Challenges and prospects of 2D electronics for future monolithic CFETs 🔗 SKKU, Hanyang U. et al.
A Device-Physics-Informed Artificial Neural Network Approach for Thermal-Aware I-V and C-V Modeling of GAA FETs 🔗 National Yang Ming Chiao Tung U.
Reduced-crosstalk antennas for grating-lobe-free and wide-field-of-view integrated optical phased arrays 🔗 MIT
CMOS-compatible ferroelectric tunnel junctions integrate stochastic sampling and deterministic computing for image generation 🔗 SNU, SKKU, SK hynix et al.

 

Early Functional Safety and PPA evaluation for faster digital design development 🔗 Politecnico di Torino, Synopsys

Find more semiconductor research papers here.

 



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