Chip Industry Technical Paper Roundup: May 19


New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations Micro-Transfer Printing on Silicon Photonics: Tutorial, Recent Progress and Outlook 🔗 Ghent U., imec Challenges and prospects of 2D electronics for future monolithic CFETs 🔗 SKKU, Hanyang U. et al. A Device-Physics-Informed Artific... » read more

A Comprehensive Study Of Integrating 2D Materials With CFET Architecture (SKKU, et al.)


A new technical paper, "Challenges and prospects of 2D electronics for future monolithic complementary field-effect transistors," was published by researchers at Sungkyunkwan University, Hanyang University, Istituto Italiano di Tecnologia, Shanghai University, Jeonbuk National University, and Kyonggi University. Abstract "With planar complementary metal-oxide-semiconductor (CMOS) scaling ... » read more

HW-Based Image Generation Using FTJs (SNU, Sungkyunkwan U., SK hynix et al.)


A new technical paper, "CMOS-compatible ferroelectric tunnel junctions integrate stochastic sampling and deterministic computing for image generation," was published by researchers at Seoul National University, Sungkyunkwan University, Hanyang University, Sogang University, and SK Hynix. Abstract "Recent progress in generative modeling has intensified the need for compact, energy-efficien... » read more

Research Bits: Feb. 24


Growing patterned diamond Researchers from Rice University developed a bottom-up microwave plasma chemical vapor deposition method for growing patterned diamond surfaces that could help decrease operating temperatures in electronics by 23 degrees Celsius. The team used two techniques for controlling seed crystal placement. Photolithography was used for small, detailed patterns. To scale up ... » read more

Chip Industry Technical Paper Roundup: Dec 22


New technical papers recently added to Semiconductor Engineering’s library: [table id=506 /] Find more semiconductor research papers here and in the most recent Chip Industry Week in Review. » read more

Analysis of Thermal and Mechanical Behavior for Advanced Packaging (Sungkyunkwan Univ. et al)


A new technical paper titled “A review of the thermo-mechanical analysis framework for microelectronics packaging: Mechanics, material property determination, and structural considerations” was published by researchers at Sungkyunkwan University, Korea Institute of Industrial Technology, Korea University, Seoul National University, and Pukyong National University. Abstract Excerpt “... » read more

Chip Industry Technical Paper Roundup: Dec. 16


New technical papers recently added to Semiconductor Engineering’s library: [table id=501 /] Find more semiconductor research papers here and in the most recent Chip Industry Week in Review. » read more

Integrating vdW-Interface-Based high-κ Dielectrics On Both n- And p-Type 2D Semiconductors (Sungkyunkwan U., KAIST)


A new technical paper "High-κ dielectric van der Waals integration on 2D semiconductors for three-dimensional complementary logic systems" was published by researchers at Sungkyunkwan University and KAIST. "This scalable methodology enables the vertical integration of complementary logic, demonstrated by complementary FET inverters and ring oscillators, establishing a promising route toward... » read more

Chip Industry Technical Paper Roundup: Dec. 8


New technical papers recently added to Semiconductor Engineering’s library: [table id=499 /] Find more semiconductor research papers here and in the most recent Chip Industry Week in Review.   » read more

Advanced Packaging: IPL Reflow Technology For Thermal Regulation (Sungkyunkwan Univ.)


A new technical paper titled "A color-coded light-induced heating technology for Pb-free solder joints of advanced multi-semiconductor packaging" was published by researchers at Sungkyunkwan University. Excerpt from paper: "This study introduces a color-coded intense pulsed light (IPL) reflow process, leveraging differential light absorption for localized thermal modulation, enabling simu... » read more

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