Chip Industry Technical Paper Roundup: Nov. 26


New technical papers recently added to Semiconductor Engineering’s library: [table id=494 /] Find more semiconductor research papers here. » read more

Advantages Of IPL Soldering Over Reflow Soldering For Cu Pillar Bump Interconnections On Glass Substrates (Chungbuk, Sungkyunkwan Univ.)


A new technical paper titled "Ultrafast Semiconductor Chip Bonding Using Intense Pulsed Light Soldering for Chip-on-Glass Packaging" was published by researchers at Sungkyunkwan University and Chungbuk National University. Abstract: "The increasing demand for miniaturization and improved performance in electronic devices has driven the exploration of glass substrates and advanced soldering ... » read more

Research Bits: Nov. 10


Post-doping plasma for DRAM capacitors Researchers from Ulsan National Institute of Science and Technology (UNIST), Pohang University of Science and Technology (POSTECH), and Seoul National University of Science and Technology developed a post-doping plasma (PDP) process to improve the performance of DRAM capacitors. Aluminum-doped titanium dioxide (Al-doped TiO2) is a promising material fo... » read more

Chip Industry Technical Paper Roundup: Nov. 4


New technical papers recently added to Semiconductor Engineering’s library: [table id=488 /] Find more semiconductor research papers here. » read more

Utilizing Chiplet-Locality For Efficient Memory Mapping In MCM GPUs (ETRI, Sungkyunkwan Univ.)


A new technical paper titled "Leveraging Chiplet-Locality for Efficient Memory Mapping in Multi-Chip Module GPUs" was published by researchers at Electronics and Telecommunications Research Institute (ETRI) and Sungkyunkwan University. Abstract "While the multi-chip module (MCM) design allows GPUs to scale compute and memory capabilities through multi-chip integration, it introduces memory ... » read more

Research Bits: Oct. 21


Direct patterning with UV cross-linking Researchers from Ulsan National Institute of Science and Technology (UNIST), Yonsei University, Sungkyunkwan University, University of Chemistry and Technology Prague, and Sogang University developed a technique that enables the direct patterning of 2D semiconductor materials onto substrates without the use of toxic solvents. The process involves disp... » read more

Chip Industry Technical Paper Roundup: July 1


New technical papers recently added to Semiconductor Engineering’s library: [table id=426 /] Find more semiconductor research papers here. » read more

Device Architecture For 2D Material-Based mNS-FETs In Sub-1nm Nodes (Sungkyunkwan Univ., Alsemy)


A new technical paper titled "Exploring optimal TMDC multi-channel GAA-FET architectures at sub-1nm nodes" was published by researchers at Sungkyunkwan University and Alsemy Inc. "This paper explores the design and optimization of multi-Nanosheet Field-Effect Transistors (mNS-FETs) employing a Transition Metal Dichalcogenide (TMDC) channel, specifically MoS2, for the 0.7 nm technology node u... » read more

2D Materials Roadmap: Current And Future Challenges, Solutions


A new technical paper titled "The 2D Materials Roadmap" was published by researchers at many institutions including Chinese Academy of Sciences, TU Denmark, Pennsylvania State University, University of Manchester, University of Cambridge et al. Abstract "Over the past two decades, 2D materials have rapidly evolved into a diverse and expanding family of material platforms. Many members of th... » read more

Chip Industry Technical Paper Roundup: Feb. 25


New technical papers recently added to Semiconductor Engineering’s library: [table id=408 /] Find all technical papers here. » read more

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