Chip Industry Technical Paper Roundup: Feb. 3

AI-aided chip design; Cu-barrier properties of 2D WS2 films; safe autonomous driving; ultra-low-bit LLM models; out-of-band power side-channel detection; MFMIS FeTFETs for CIM HW accelerators; SNNs on neuromorphic HW; oxide semiconductor for advanced memory architectures.

popularity

New technical papers recently added to Semiconductor Engineering’s library:

Technical Paper Research Organizations
ChipBench: A Next-Step Benchmark for Evaluating LLM Performance in AI-Aided Chip Design UCSD and Columbia University
Enhancing Cu-barrier properties of 2D-WS2 barriers: The role of grain size and surface passivation NUS, AIXTRON, IMiF and Applied Materials
Chiplet Fundamentals For Engineers: eBook Semiconductor Engineering
Towards Safe Autonomous Driving: A Real-Time Motion Planning Algorithm on Embedded Hardware TU Munich
Pushing the Envelope of LLM Inference on AI-PC and Intel GPUs Intel
Out-of-Band Power Side-Channel Detection for Semiconductor Supply Chain Integrity at Scale Cornell University
Impact of Random Phase Distribution on Ferroelectric Tunnel Field-Effect Transistors With Mitigation Strategies for Compute-in-Memory Applications Seoul National University
A Case for Hypergraphs to Model and Map SNNs on Neuromorphic Hardware Politecnico di Milano
Oxide Semiconductor for Advanced Memory Architectures: Atomic Layer Deposition, Key Requirement and Challenges Hanyang University and imec

Find more semiconductor research papers here.



Leave a Reply


(Note: This name will be displayed publicly)