High-NA EUV litho; MRDIMM performance; GPU power estimation for AI workloads; RISC-V verification; inverse-designed grating couplers; SDV drive architectures; multi-chiplet memory-centric attention serving; GAA transistor leakage.
New technical papers recently added to Semiconductor Engineering’s library:
| Technical Paper | Research Organizations |
|---|---|
| Source-position-dependent transmission cross coefficient formula including polarization and mask three-dimensional effects in High NA EUV🔗 | Science Tokyo |
| Performance and Energy Benefits of MRDIMMs 🔗 | Barcelona Supercomputing Center, UPC, Micron, Intel |
| EnergAIzer: Fast and Accurate GPU Power Estimation Framework for AI Workloads 🔗 | MIT, IBM Research |
| Verification and Validation (V&V)-in-the-Loop for RISC-V Design: The Holistic Vision of BZL 🔗 | Barcelona Supercomputing Center |
| Multimode grating couplers via foundry-compliant inverse design 🔗 | Yale University |
| Modular Drive Architecture for Software-defined Vehicles Enabled by Power-packet-based Sensorless Control 🔗 | Kyoto University |
| AMMA: A Multi-Chiplet Memory-Centric Architecture for Low-Latency 1M Context Attention Serving 🔗 | UC San Diego, Columbia University, Yonsei University, Nvidia, Samsung |
| Gate-Drain Leakage Enhanced by Drain-Induced Dielectric Barrier Lowering in GAAFETs 🔗 | Sandia National Lab, Luxembourg Institute of Science and Technology |
Find more semiconductor research papers here and the latest chip industry news here.
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