Chip Industry Technical Paper Roundup: May 11


New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations Source-position-dependent transmission cross coefficient formula including polarization and mask three-dimensional effects in High NA EUV🔗 Science Tokyo Performance and Energy Benefits of MRDIMMs 🔗 Barcelona Supercomputing Center, UPC, ... » read more

High-NA EU Lithography: Extending The STCC Formula (Science Tokyo)


A new technical paper, "Source-position-dependent transmission cross coefficient formula including polarization and mask three-dimensional effects in high-numerical-aperture extreme ultraviolet lithography" was published by researchers at Institute of Science Tokyo. This work is based on the paper presented at SPIE Advanced Lithography + Patterning 2026. "The polarization effect is not negli... » read more

Chip Industry Week In Review


Disruptions caused by the Iran conflict have taken about one third of the global helium supply off the market, an essential gas for semiconductor manufacturing, reports the World Economic Forum. Other potential impacts for the chip industry include bromine and other chemical shortages, logistical disruptions, and higher energy prices incurred by fabs in Asia. Top Deals IBM and Lam R... » read more

Chip Industry Week in Review


The IEEE ISSCC conference was held this week in San Francisco. Among the highlights: IBM detailed an AI accelerator based on its new inferencing dataflow architecture. CEA-Leti presented a chip-scale, ultra-fast, battery-operated EPR spectrometer. QuTech introduced a cryo-CMOS SoC with NV centers in diamond. UTokyo showed its low-jitter PLL architecture for beyond 5G/6G. Imec d... » read more