Chip Industry Technical Paper Roundup: May 11


New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations Source-position-dependent transmission cross coefficient formula including polarization and mask three-dimensional effects in High NA EUV🔗 Science Tokyo Performance and Energy Benefits of MRDIMMs 🔗 Barcelona Supercomputing Center, UPC, ... » read more

Replacing GPU Compute Dies With PNM-Enabled HBM Cubes For Long-Context Decode Attention (UCSD, Columbia, Yonsei U., NVIDIA, Samsung)


A new technical paper, "AMMA: A Multi-Chiplet Memory-Centric Architecture for Low-Latency 1M Context Attention Serving," was published by researchers at UC San Diego, Columbia University, Yonsei University, NVIDIA, and Samsung. Abstract "All current LLM serving systems place the GPU at the center, from production-level attention-FFN disaggregation to NVIDIA's Rubin GPU-LPU heterogeneous p... » read more

Chip Industry Technical Paper Roundup: Mar. 3


New technical papers recently added to Semiconductor Engineering’s library: Technical Paper Research Organizations AutoGNN: End-to-End Hardware-Driven Graph Preprocessing for Enhanced GNN Performance 🔗 KAIST, Panmnesia, Peking University, Hanyang University, Pennsylvania State University Sputtering-driven formation of interstitial oxygen for intrinsic NIR detec... » read more

CMOS-Compatible Approach to Extending the Spectral Response of Oxide Semiconductors


A new technical paper titled "Sputtering-driven formation of interstitial oxygen for intrinsic NIR detection in IGZO phototransistor" was published by researchers at KICET, Korea University, Yonsei University, and Argonne National Lab. Abstract "Amorphous indium gallium zinc oxide (a-IGZO) is a promising wide-bandgap semiconductor for large-area optoelectronics; however, its intrinsic ins... » read more

Research Bits: Oct. 21


Direct patterning with UV cross-linking Researchers from Ulsan National Institute of Science and Technology (UNIST), Yonsei University, Sungkyunkwan University, University of Chemistry and Technology Prague, and Sogang University developed a technique that enables the direct patterning of 2D semiconductor materials onto substrates without the use of toxic solvents. The process involves disp... » read more

Chip Industry Technical Paper Roundup: August 26


New technical papers recently added to Semiconductor Engineering’s library: [table id=467 /] Find more semiconductor research papers here. » read more

Reconfigurable Single-Walled CNT FeFET (Univ. of Pennsylvania, Yonsei et al.)


A new technical paper titled "Reconfigurable single-walled carbon nanotube ferroelectric field-effect transistors" was published by researchers at University of Pennsylvania, Yonsei University, Kookmin University, SKKU and Peking University. Abstract "Reconfigurable devices have garnered significant attention for alleviating the scaling requirements of conventional complementary metal-oxide... » read more

Chip Industry Week in Review


Apple plans to increase its U.S. investment by an additional $100 billion over four years, which includes the launch of an advanced manufacturing supply chain program, spurring a number of related chip industry announcements, including: Apple will invest in Amkor's new packaging and test facility in Arizona as its first and largest customer, and Amkor will package and test Apple silicon pr... » read more

Chip Industry Technical Paper Roundup: Feb. 25


New technical papers recently added to Semiconductor Engineering’s library: [table id=408 /] Find all technical papers here. » read more

Low-Cost TSV Repair Architecture Specialized for Highly Clustered TSV Faults Within HBM


A new technical paper titled "Low Cost TSV Repair Architecture Using Switch-Based Matrix for Highly Clustered Faults" was published by researchers at Yonsei University. Abstract "Through-silicon via (TSV), responsible for inter-layer communication in high-bandwidth memory (HBM), plays a critical role in HBM operation. Therefore, faults occur in TSVs can critically impact the entire chips. H... » read more

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