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Flip-Chip Bonding Technique To Excite LN Resonators Via Noncontact Electrodes (Yale)

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A new technical paper titled “Noncontact excitation of multi-GHz lithium niobate electromechanical resonators” was published by researchers at Yale University.

Abstract
“The demand for high-performance electromechanical resonators is ever-growing across diverse applications, ranging from sensing and time-keeping to advanced communication devices. Among the electromechanical materials being explored, thin-film lithium niobate stands out due to its strong piezoelectric properties and low acoustic loss. However, in nearly all existing lithium niobate electromechanical devices, the configuration is such that the electrodes are in direct contact with the mechanical resonator. This configuration introduces an undesirable mass-loading effect, producing spurious modes and additional damping. Here, we present an electromechanical platform that mitigates this challenge by leveraging a flip-chip bonding technique to separate the electrodes from the mechanical resonator. By offloading the electrodes from the resonator, our approach yields a substantial increase in the quality factor of these resonators, paving the way for enhanced performance and reliability for their device applications.”

Find the technical paper here. Published September 2024.

Wang, D., Xie, J., Guo, Y. et al. Noncontact excitation of multi-GHz lithium niobate electromechanical resonators. Microsyst Nanoeng 10, 124 (2024). https://doi.org/10.1038/s41378-024-00771-9. http://creativecommons.org/licenses/by/4.0/.



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