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Die-level Thinning and Integrating Route For Singulated MPW Chips Using Both Silicon Sensors and CMOS Devices


Abstract "Die-level thinning, handling, and integration of singulated dies from multi-project wafers (MPW) are often used in research, early-stage development, and prototyping of flexible devices. There is a high demand for thin silicon devices for several applications, such as flexible electronics. To address this demand, we study a novel post-processing method on two silicon devices, an el... » read more

Electrically pumped laser transmitter integrated on thin-film lithium niobate


New research paper from Harvard, in collaboration with Freedom Photonics and HyperLight Corp, and with funding from DARPA and Air Force Office of Scientific Research. Abstract "Integrated thin-film lithium niobate (TFLN) photonics has emerged as a promising platform for the realization of high-performance chip-scale optical systems. Of particular importance are TFLN electro-optic modulato... » read more