Finding Defects In IC Packages


Several equipment makers are ramping up new inspection equipment to address the growing defect challenges in IC packaging. At one time, finding defects in packaging was relatively straightforward. But as packaging becomes more complex, and as it is used in markets where reliability is critical, finding defects is both more difficult and more important. This has prompted the development of a ... » read more

Planning For Panel-Level Fan-out


Several companies are developing or ramping up panel-level fan-out packaging as a way to reduce the cost of advanced packaging. Wafer-level fan-out is one of several advanced packaging types where a package can incorporate dies, MEMS and passives in an IC package. This approach has been in production for years, and is produced in a round wafer format in 200mm or 300mm wafer sizes. Fan-out... » read more

MEMS And Sensor Tech For The Next Decade


Most of today’s blockbuster MEMS products – from pressure sensors and resonators to accelerometers and microphones – originated from academic research, a trend that Alissa M. Fitzgerald, Founder & Managing Member, A.M. Fitzgerald & Associates, expects to continue. While many of these potentially game-changing new technologies will require many more years of intensive development a... » read more

Process To Produce High Aspect Ratio Electroplated Copper Pillars On 300 mm Wafers


This work provides details of a complete and partially optimized process to manufacture high aspect ratio copper pillars with heights of up to 80 µm on 200 and 300 mm wafers. Across wafer uniformity data for all materials and process steps are given. Results will show excellent resist adhesion on copper and electroplating durability. Cross sectional SEM analysis of resist and electroplated pil... » read more

Implementing A Multi-Domain System


IoT systems are multi-domain designs that often require AMS, Digital, RF, photonics and MEMS elements within the system. Tanner EDA provides an integrated, top-down design flow for IoT design that supports all these design domains. Learn more about key solutions that the Tanner design flow offers for successful IoT system design and verification. To read more, click here. » read more

Power/Performance Bits: Sept. 11


Thread transistor Researchers at Tufts University developed a thread-based transistor that can be fashioned into simple, all-thread based logic circuits and integrated circuits which could be woven into fabric or worn on the skin, or even surgically implanted. The thread-based transistor (TBT) is made of a linen thread coated with carbon nanotubes, creating a semiconductor surface. Two thin... » read more

Week In Review: Manufacturing, Test


China's DRAM efforts Two memory vendors from China, Tsinghua Unigroup and ChangXin Memory Technology, have disclosed more details about their respective efforts to enter the DRAM arena. As reported, Tsinghua Unigroup wants to enter the DRAM business. Now, the China-based firm has secured land to build a new DRAM fab. The firm recently signed an agreement with the Chongqing government to e... » read more

Manufacturing Bits: Aug. 5


Chemical weapon sensors Using nanoelectromechanical system (NEMS) technologies and other parts, Sandia National Laboratories has developed a tiny gas chromatograph sensor for use in detecting toxic gases and chemical weapons. Chemical identification involves the use of various instruments and systems. Larger systems are used in the lab. A portable version, called a mass spectrometer, is ava... » read more

200mm Cools Off, But Not For Long


After years of acute shortages, 200mm fab capacity is finally loosening up, but the supply/demand picture could soon change with several challenges on the horizon. 200mm fabs are older facilities with more mature processes, although they still churn out a multitude of today’s critical chips, such as analog, MEMS, RF and others. From 2016 to 2018, booming demand for these and other chips ca... » read more

HW/SW Design At The Intelligent Edge


Adding intelligence to the edge is a lot more difficult than it might first appear, because it requires an understanding of what gets processed where based on assumptions about what the edge actually will look like over time. What exactly falls under the heading of Intelligent Edge varies from one person to the next, but all agree it goes well beyond yesterday’s simple sensor-based IoT dev... » read more

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