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Power/Performance Bits: March 8


Non-toxic, printable piezoelectric Researchers at RMIT University and University of New South Wales developed a flexible and printable piezoelectric material that could be used in self-powered electronics including wearables and implantables. "Until now, the best performing nano-thin piezoelectrics have been based on lead, a toxic material that is not suitable for biomedical use," said Dr N... » read more

WLFO For High-Performance Low-Cost Packaging Of RFMEMS-CMOS


Navigating the trade-offs between performance, size, cost and reliability can be a challenge when considering integrated circuit (IC) packaging and the end-application. The integration of micro-electromechanical systems (MEMS), either monolithic or heterogeneous, introduces yet another level of complexity that has only recently been a major focus of multi-device packaging. Wafer-level fanout (W... » read more

200mm Demand Surges


A surge in demand for various chips is causing shortages for select 200mm foundry capacity as well as 200mm fab equipment, and it shows no signs of abating in 2021. Foundry customers will face a shortfall of 200mm capacity at select foundries at least in the first half of 2021, and perhaps beyond. Those customers will need to plan ahead to ensure they obtain enough 200mm capacity in 2021. Ot... » read more

Are Today’s MEMS Gyros “Good Enough”?


The gyroscope market is heating up, fueled by increasingly autonomous vehicles, robots, and industrial equipment, all of which are demanding greater precision and ever-smaller devices. Gyroscopes historically have been a staple in navigation for years. However, classic designs are macro-mechanical, and high-performance units can be very expensive. For lower-performance applications, micro-el... » read more

Blog Review: Oct. 7


In a blog for Arm, University of Southampton PhD student Sivert Sliper looks at how energy-driven and intermittent computing could be used to power trillions of IoT devices and introduces a SystemC-based simulator for such systems. Mentor's Chris Spear explains why transaction classes should extend from uvm_sequence_item rather than uvm_transaction when designing UVM testbenches. Cadence'... » read more

Data Becomes Key For Next-Gen Chips


Data has become vital to understanding the useful life of a semiconductor — and the knowledge gleaned is key to staying competitive beyond Moore’s Law. What's changed is a growing reliance earlier in the design cycle on multiple sources of data, including some from further right in the design-through-manufacturing flow. While this holistic approach may seem logical enough, the semiconduc... » read more

The Next Advanced Packages


Packaging houses are readying their next-generation advanced IC packages, paving the way toward new and innovative system-level chip designs. These packages include new versions of 2.5D/3D technologies, chiplets, fan-out and even wafer-scale packaging. A given package type may include several variations. For example, vendors are developing new fan-out packages using wafers and panels. One is... » read more

Week In Review: Auto, Security, Pervasive Computing


COVID-19/Medical Mentor's parent company Siemens is making its Additive Manufacturing (AM) Network, along with its 3D printers, available to the global medical community. MEMS is at the forefront of SARS-CoV-2 testing, writes Alissa M. Fitzgerald, founder of AMFitzgerald in a blog on SEMI.org. Fitzgerald points out a MEMS silicon PCR chip, developed by Northrup et. al. at Lawrence Livermore... » read more

The Next Technology Frontier In MEMS Gyroscopes


In MEMS technology development, it is always exciting to see the next technology frontier, the border of the known and the unknown. Talent and hard work (along with ingenuity) can move this frontier and enrich all of us. We respect the efforts of MEMS innovators, who have developed original and creative ideas by building upon past knowledge and wisdom and have integrated this knowledge across m... » read more

Week In Review: Manufacturing, Test


Fab tools The United States is mulling over new trade export restrictions for U.S. fab equipment to China, according to a report from The Wall Street Journal. “Recent press reports suggest the U.S. Department of Commerce is exploring additional measures to limit Huawei's access to U.S. semiconductor capital equipment (SPE) by requiring chip manufacturing plants globally to procure license... » read more

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