Are Today’s MEMS Gyros “Good Enough”?


The gyroscope market is heating up, fueled by increasingly autonomous vehicles, robots, and industrial equipment, all of which are demanding greater precision and ever-smaller devices. Gyroscopes historically have been a staple in navigation for years. However, classic designs are macro-mechanical, and high-performance units can be very expensive. For lower-performance applications, micro-el... » read more

Blog Review: Oct. 7


In a blog for Arm, University of Southampton PhD student Sivert Sliper looks at how energy-driven and intermittent computing could be used to power trillions of IoT devices and introduces a SystemC-based simulator for such systems. Mentor's Chris Spear explains why transaction classes should extend from uvm_sequence_item rather than uvm_transaction when designing UVM testbenches. Cadence'... » read more

Data Becomes Key For Next-Gen Chips


Data has become vital to understanding the useful life of a semiconductor — and the knowledge gleaned is key to staying competitive beyond Moore’s Law. What's changed is a growing reliance earlier in the design cycle on multiple sources of data, including some from further right in the design-through-manufacturing flow. While this holistic approach may seem logical enough, the semiconduc... » read more

The Next Advanced Packages


Packaging houses are readying their next-generation advanced IC packages, paving the way toward new and innovative system-level chip designs. These packages include new versions of 2.5D/3D technologies, chiplets, fan-out and even wafer-scale packaging. A given package type may include several variations. For example, vendors are developing new fan-out packages using wafers and panels. One is... » read more

Week In Review: Auto, Security, Pervasive Computing


COVID-19/Medical Mentor's parent company Siemens is making its Additive Manufacturing (AM) Network, along with its 3D printers, available to the global medical community. MEMS is at the forefront of SARS-CoV-2 testing, writes Alissa M. Fitzgerald, founder of AMFitzgerald in a blog on SEMI.org. Fitzgerald points out a MEMS silicon PCR chip, developed by Northrup et. al. at Lawrence Livermore... » read more

The Next Technology Frontier In MEMS Gyroscopes


In MEMS technology development, it is always exciting to see the next technology frontier, the border of the known and the unknown. Talent and hard work (along with ingenuity) can move this frontier and enrich all of us. We respect the efforts of MEMS innovators, who have developed original and creative ideas by building upon past knowledge and wisdom and have integrated this knowledge across m... » read more

Week In Review: Manufacturing, Test


Fab tools The United States is mulling over new trade export restrictions for U.S. fab equipment to China, according to a report from The Wall Street Journal. “Recent press reports suggest the U.S. Department of Commerce is exploring additional measures to limit Huawei's access to U.S. semiconductor capital equipment (SPE) by requiring chip manufacturing plants globally to procure license... » read more

Demand Picks Up For 200mm


Demand is growing for both 200mm fab capacity and equipment, setting the stage for possible shortages in coming months. But there are also some uncertainties, if not warning signs, in the 200mm market and the entire IC industry. Trade disputes, as well as the current coronavirus outbreak in China, likely will impact the chip and equipment markets. The size of the impact and the duration rema... » read more

Finding Defects In IC Packages


Several equipment makers are ramping up new inspection equipment to address the growing defect challenges in IC packaging. At one time, finding defects in packaging was relatively straightforward. But as packaging becomes more complex, and as it is used in markets where reliability is critical, finding defects is both more difficult and more important. This has prompted the development of a ... » read more

Planning For Panel-Level Fan-out


Several companies are developing or ramping up panel-level fan-out packaging as a way to reduce the cost of advanced packaging. Wafer-level fan-out is one of several advanced packaging types where a package can incorporate dies, MEMS and passives in an IC package. This approach has been in production for years, and is produced in a round wafer format in 200mm or 300mm wafer sizes. Fan-out... » read more

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