中文 English

Ultra-Low Resonance Frequency MEMS Gravimeter With Off-Resonance Closed-Loop Control


This paper reports on a MEMS gravimeter that has a closed-loop system to maintain an ultra-low resonance frequency of 1Hz. The low resonance frequency is attained by using a spring that is the resultant of positive mechanical stiffnesses and negative electrical stiffnesses. Voltage-tunability of the electrical stiffness enables ultra-small and tunable total stiffness. To attain a quick response... » read more

There Is Plenty Of Room At The Top: Imagining Miniaturized Electro-Mechanical Switches In Low-Power Computing Applications


The first computers were built using electro-mechanical components, unlike today’s modern electronic systems. Alan Turing’s cryptanalysis multiplier and Konrad Zuse’s Z2 were invented and built in the first half of the 20th century, and were among the first computers ever constructed. Electro-mechanical switches and relays performed logic operations in these machines. Even after computers... » read more

Research Bits: March 1


Large-scale phased array Researchers at Princeton University developed a large-scale high-frequency antenna array using thin-film materials. “To achieve these large dimensions, people have tried discrete integration of hundreds of little microchips. But that’s not practical — it’s not low-cost, it’s not reliable, it’s not scalable on a wireless systems level,” said senior stud... » read more

A Sub-1 Hz Resonance Frequency Resonator Enabled By Multi-Step Tuning For Micro-Seismometer


We propose a sub-1 Hz resonance frequency MEMS resonator that can be used for seismometers. The low resonance frequency is achieved by an electrically tunable spring with an ultra-small spring constant. Generally, it is difficult to electrically fine-tune the resonance frequency at a near-zero spring constant because the frequency shift per voltage will diverge at the limit of zero spring const... » read more

What Causes Semiconductor Aging?


Semiconductor technology has evolved to the point where no one can assume chips will last forever. If not carefully considered, aging can shorten the life of an IC below the needs for an intended application. Aging is well studied in technology circles, but while others less directly involved may understand at a general level this is a problem, it's not always obvious why. So what exactly ar... » read more

200mm Shortages May Persist For Years


A surge in demand for chips at more mature process nodes is causing shortages for both 200mm foundry capacity and 200mm equipment, and it shows no signs of letting up. In fact, even with new capacity coming on line this year, shortages are likely to persist for years, driving up prices and forcing significant changes across the semiconductor supply chain. Shortages for both 200mm foundry cap... » read more

Preventing Failures Before They Occur


A decade or so ago, when MEMS sensors were in the limelight, one of the touted applications was to install them on industrial or other equipment to get an advance warning if the equipment was approaching failure. Today, in-circuit monitoring brings the same promise. Are these competing technologies? Or can they be made to work together? “Almost all advanced tool manufacturing companies ... » read more

Manufacturing Shifts To AI Of Things


AI is being infused into the Internet of Things, setting the stage for significant improvements in manufacturing productivity, improved uptime, and reduced costs — regardless of market segment. The traditional approach to improving manufacturing equipment reliability and efficiency is regular scheduled maintenance. While that is an improvement over just fixing or replacing equipment when i... » read more

Achieving Success In Automotive Leadframe Packages


The growth of semiconductor content in automotive applications has been accelerating. This growth drives all families of semiconductor packaging in all regions. The growth is happening in the latest advanced, laminate-based packages using flip chip interconnect as well as the venerable leadframe packages using wirebond interconnect. The automotive market consumes micro-electromechanical systems... » read more

Reaching silicon-based NEMS performances with 3D printed nanomechanical resonators


Abstract: "The extreme miniaturization in NEMS resonators offers the possibility to reach an unprecedented resolution in high-performance mass sensing. These very low limits of detection are related to the combination of two factors: a small resonator mass and a high quality factor. The main drawback of NEMS is represented by the highly complex, multi-steps, and expensive fabrication process... » read more

← Older posts