Will Higher Production Costs Hamper IoT Growth?


No question, 2017 is expected to be a good year for the semiconductor industry. Semiconductor revenues for 2017 are expected to increase more than 9% this year. A 6% increase in unit sales, as well as higher average selling prices for memory products, will help drive the revenue growth rate to its highest level since 2010. Wafer demand is forecast to grow by almost 8%. The higher revenue growth... » read more

200mm Crisis?


Over the last year or so, the IC industry has experienced an acute shortage of both 200mm fab capacity and 200mm equipment amid a surge of demand for certain chips. Right now, though, the 200mm shortfall is much worse than before. But this situation isn’t expected to improve for both elements in the second half of 2017, and perhaps beyond. On the capacity front, chipmakers are generally... » read more

The Week In Review: IoT


Conferences The Internet of Things World conference is on tap next week at the Santa Clara Convention Center in Silicon Valley. There will be more than 250 exhibitors on the show floor, with 11,000 attendees expected. More than 400 speakers will make presentations over three days, May 16-17-18. ON Semiconductor will have a number of IoT-related products to demonstrate at its booth, including i... » read more

The Future of Testing


In our previous test blog posts, we looked at the history of automated test equipment for semiconductors and for printed circuit boards. This month, we look ahead to the test technologies that are emerging. The chip ATE field has essentially boiled down to Advantest, Teradyne, and Xcerra (LTX-Credence), while the board test market is dominated by Teradyne and Keysight Technologies (formerly ... » read more

Wirebond Technology Rolls On


Several years ago, many predicted the demise of an older interconnect packaging technology called wire bonding, prompting the need for more advanced packaging types. Those predictions were wrong. The semiconductor industry today uses several advanced packaging types, but wire bonding has been reinvented over the years and remains the workhorse in packaging. For example, Advanced Semiconducto... » read more

Whatever Happened To High-Level Synthesis?


A few years ago, [getkc id="105" comment="high-level synthesis"] (HLS) was probably the most talked about emerging technology. It was to be the heart of a new Electronic System Level (ESL) flow. Today, we hear much less about the progress being made in this area. Semiconductor Engineering sat down to discuss this with Bryan Bowyer, director of engineering for high level design and verificati... » read more

RF Device And Process Biz Heats Up


The RF device and process technology markets are heating up, especially for two critical components used in smartphones—RF switch devices and antenna tuners. RF device makers and their foundry partners continue to ramp up traditional RF switch chips and tuners based on RF SOI process technologies for today’s 4G wireless networks. And recently, [getentity id="22819" comment="GlobalFoundri... » read more

Time For Massively Parallel Testing


Time is money in electronics, as in other industries, and the more time that is invested in testing chips means more costs being added to the product in question. To speed up testing for memory devices and other semiconductors, test equipment vendors have resorted to parallel testing technology, simultaneously testing multiple chips at a time. The industry also is turning to system-level tes... » read more

How Testing MEMS, Sensors Is Different


When it comes to testing microelectromechanical system devices and sensors, sometimes you have to shake and bake. [getkc id="311" comment="MEMS"] and [getkc id="187" kc_name="sensors"] are physically different from standard ICs. They require a specific type of stimulus to get the required testing results. Most chips only need to have an electrical charge run through them to gauge their pass/... » read more

What’s New On The MEMS Horizon?


In my previous blog post, I discussed emerging trends and the increased demand for MEMS; now I’ll focus on what we can expect in the immediate future in terms of new device technologies and MEMS-enabled products. While the more well-known MEMS such as accelerometers, gyroscopes, microphones and pressure sensors continue to grow in volume as they find new applications in things like wire... » read more

← Older posts