tag: MEMS

The Specialty Device Surge Part 3: Solving The Process Control Challenges Of MEMS, Photonics, Co-Packaged Optics, And More
By Christopher Haire - 12 May, 2026 - Comments: 0

Every day, consumers rely on an invisible network of specialty semiconductor devices without realizing it. The smartphone in your pocket is a good place to start. It knows when you rotate the screen thanks to MEMS sensors, and its camera delivers crisp images through advanced CMOS image sensors. Meanwhile, fast charging technology, wireless connectivity, facial recognition, and high-frequency c... » read more

The Specialty Device Surge Part 2: The Process Control Challenges Of MEMS, Co-Packaged Optics, And More
By Christopher Haire - 07 Apr, 2026 - Comments: 0

In a world where high-bandwidth memory, GPUs, and advanced AI packages are all the rage, it is easy to forget the important role specialty devices play. These unsung heroes of modern life perform critical functions across a wide range of industries, including automotive, telecommunications, data centers, emerging AI hardware ecosystems, and consumer electronics, just like the smartphone in your... » read more

Flexible ICs, MEMS, Metal Oxides Solve Fresh Problems
By Liz Allan - 05 Feb, 2026 - Comments: 0

Key Takeaways: Flexible ICs are durable and form-fitting, but they add manufacturing challenges to already complex processes, while printed flex sensors lack infrastructure. MEMS are finding new popularity in massively parallel systems, on one device, or in many devices distributed across a network. Metal oxide-based sensors are more scalable than those relying on photonic crystals, ... » read more

How Photonics And Handheld Ultrasounds Are Transforming Medical Imaging
By M. Rameez Arif - 27 Oct, 2025 - Comments: 0

Medical imaging has always been a race against time: delivering accurate diagnosis to patients with the speed modern healthcare demands. Traditionally, that meant large, immobile ultrasound machines tucked away in radiology departments, often forcing patients to wait days or weeks for the imaging needed to move forward with treatment. But in recent years, the industry has been moving toward som... » read more

Advanced Packaging: A Key Technology For The Next Generation Of Electronics
By Andy Heinig - 16 Oct, 2025 - Comments: 1

In recent years, advanced packaging has become much more important. While semiconductor manufacturers used to focus primarily on miniaturization and increasing the performance of individual chips, the focus is increasingly shifting to the system level: How can processor cores, memory, sensors, and wireless modules be integrated as efficiently, compactly, and powerfully as possible within a sing... » read more

Research Bits: Sept. 30
By Jesse Allen - 30 Sep, 2025 - Comments: 0

Hybrid memory for edge training and inference Researchers from CEA-Leti, Université Grenoble Alpes, CEA-List, the French National Centre for Scientific Research (CNRS), the University of Bordeaux, Bordeaux INP, IMS France, Université Paris-Saclay, and the Center for Nanosciences and Nanotechnologies developed a hybrid memory system that combines the traits of ferroelectric capacitors (FeCAP)... » read more

Glass Substrates Gain Momentum
By Laura Peters - 18 Sep, 2025 - Comments: 1

As a package substrate, the benefits of glass are substantial. It's extremely flat with lower thermal expansion than organic substrates, which simplifies lithography. And that's just for starters. Warpage, a growing problem for multichip packages, is greatly reduced. Chips can be hybrid bonded to redistribution layer pads on glass. And relative to organic-core substrates, glass provides very... » read more

Volatile And Non-Volatile NEM Switches Fabricated In A CMOS-Compatible SOI Foundry Platform (KTH, U. of Bristol, EPFL, Imec)
By Technical Paper Link - 16 Jul, 2025 - Comments: 0

A new technical paper titled "Volatile and non-volatile nano-electromechanical switches fabricated in a CMOS-compatible silicon-on-insulator foundry process" was published by researchers at KTH Royal Institute of Technology, University of Bristol, EPFL, imec, and Ghent University. Abstract "Nanoelectromechanical (NEM) switches have the advantages of zero leakage current, abrupt switching ch... » read more

New Package Solutions for Automotive Optical Sensors
By Amkor - 22 May, 2025 - Comments: 0

This article introduces the development of a new optical ball grid array (OBGA) packaging platform designed for automotive applications, with a focus on platform development and compliance with the Automotive Electronics Council (AEC) AEC-Q100 Grade 2 reliability standard. The proposed packaging solution extends beyond traditional cavity OBGA packages, which have been primarily utilized for mic... » read more

Can Chiplets Serve Cost-Conscious Apps?
By Bryon Moyer - 17 Apr, 2025 - Comments: 0

Chiplets are emerging as a significant new phase in the evolution of the semiconductor market, providing a way to continue scaling performance well beyond the size limitations of a reticle. But that improvement comes with a high price tag and a lot more complexity, which so far has limited adoption. One of the main reasons for the cost increase is the need for advanced packaging when employi... » read more

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