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Extracting Intrinsic Mechanical Properties Of Thin Low-Dielectric Constant Materials With iTF Analysis


This white paper focuses on the optimization and use of Bruker’s iTF software package for the extraction of intrinsic (substrate independent) mechanical properties, particularly for thin, low-k materials. These considerations are split into two main parts: Measurement procedure (Section II) and iTF execution (Section III). The former outlines important aspects of acquiring proper experimental... » read more

Residual Stress With EIGER2 R 500K


Many manufacturing processes leave residual stresses which can affect the performance of manufactured components. Compressive stress can be engineered into a metal coating to resist crack propagation, while tensile stress can be exploited to enhance conductivity in semiconductors. Strained materials exhibit changes in atomic spacing which can be detected by X-ray diffraction (XRD) and related t... » read more

Characterization Of CMP Processes With White Light Interferometry


Faster computer and electronic processors require smaller features for integrated circuits (IC), which in turn require smaller and smoother substrate surfaces. Chemical mechanical polishing (CMP) has become one of the most critical semiconductor fabrication technologies because it offers a superior means of removing unwanted topography in interlevel dielectric layers and achieving sufficient pl... » read more