Research Bits: Apr. 7
DNA scaffolds for 3D electronics; removing defects from MoS2.
Chip Industry Technical Paper Roundup: Apr. 7
Benchmarking ultra-low-power μNPUs; pSRAM bitcell for high-speed; connected vehicles security; HW security verification; contact layer attributes;...
Research Bits: Apr. 1
Neuro-synaptic RAM; 3D photonic-electronic data link; complex memory management.
Chip Industry Technical Paper Roundup: Apr. 1
Nvidia GPUs; HW ANNs; optimizing GPU efficiency in LLMs; ONN with ReRAM crossbar array; GaN-on-diamond; DRAM read disturbance; chiplets co-optimiza...
Research Bits: Mar. 25
2D materials in 3D transistors; electrochemical memristive mechanism; matching substrates for power electronics.
Chip Industry Technical Paper Roundup: Mar. 25
SRAM substitute; 3D photonic integration; 3DIC partitioning; CFETs design; EFO errors in wirebonding packaging process; 6G survey; multi-party comp...
Research Bits: Mar. 18
Enabling terahertz communication: High-frequency signal conversion; amplifier-multiplier; electromagnetic wave absorber.
Chip Industry Technical Paper Roundup: Mar. 10
Thermally aware chiplet placement; DRAM read disturbance; training NN with optical backpropagation; 4D mmWave radar for autonomous driving; fault i...
Research Bits: Mar. 10
Incipient ferroelectricity; superlubricity for memory; growing TMDs.
Chip Industry Technical Paper Roundup: Mar. 4
Estimating voltage drop with ML; BEOL-compatible 3D logic; wafer level SoC test; ultrathin film that preserves electrical properties; RISC-V multic...
