Chip Industry Technical Paper Roundup: Apr. 29
5nm SRAM minimum supply voltage; particle-induced mask diffraction on EUV lithography; chiplet placement and routing; HW-based heterogeneous memory...
Research Bits: Apr. 29
Chill out: Microchannels for two-phase cooling; ultra-fast heat transfer; low thermal resistance TIM.
Chip Industry Technical Paper Roundup: Apr. 22
GenAI for analog; water immersion cooling; 2D materials roadmap; stochastic computing ReRAM; sub-10nm nanogap; pre-silicon HW trojans; C2RAM on FDS...
Research Bits: April 22
Photonic AI: Heterogeneous integration; nonlinear neural network training; acoustically-mediated activation function.
Research Bits: Apr. 15
OLEDs: Shape-morphing panel with built-in speaker; bright stacked microdisplays; graphene-enabled laser lift-off.
Research Bits: Apr. 7
DNA scaffolds for 3D electronics; removing defects from MoS2.
Chip Industry Technical Paper Roundup: Apr. 7
Benchmarking ultra-low-power μNPUs; pSRAM bitcell for high-speed; connected vehicles security; HW security verification; contact layer attributes;...
Research Bits: Apr. 1
Neuro-synaptic RAM; 3D photonic-electronic data link; complex memory management.
Chip Industry Technical Paper Roundup: Apr. 1
Nvidia GPUs; HW ANNs; optimizing GPU efficiency in LLMs; ONN with ReRAM crossbar array; GaN-on-diamond; DRAM read disturbance; chiplets co-optimiza...
Research Bits: Mar. 25
2D materials in 3D transistors; electrochemical memristive mechanism; matching substrates for power electronics.
