Chip Industry Technical Paper Roundup: Feb. 10
PDN for CIM; accelerating OTA circuit design; inter-chiplet interconnects; wireless multi-chip AI accelerators; oxygen plasma treatment to enhance ...
Research Bits: Feb. 10
Memory: Speeding up 3D NAND etch; xenon in CVD; cache management.
Research Bits: Feb. 4
Diamond: High-power transistors; direct bonding; speedy wafer fabrication.
Chip Industry Technical Paper Roundup: Feb. 4
Mixed-precision DL inference; CXL memory pooling; processing-using-DRAM; Apple CPU vulnerabilities; pager and walkie-talkie attacks; ultranarrow se...
Research Bits: Jan. 28
Memory: Programmable photonic latch; gradient computing with memristors; writing MRAM.
Chip Industry Technical Paper Roundup: Jan. 28
SRAM at low temps; DeepSeek RL; TSVs; new memory class; 3nm SRAM; quantum chiplet architectures; integrated photonics; 2D TMDs; HW IP protection; a...
Chip Industry Technical Paper Roundup: Jan. 20
LLMs for chip design; CIM accelerators; polaron crossover in tellurene; M3D FPGA w/BEOL config memories; ASIC AI chips for homomorphic encryption; ...
Research Bits: Jan. 20
Neuromorphic computing: Self-correcting memristor array; tellurium nanowires; anomalous Hall torque.
Research Bits: Jan. 13
High-temp electrochemical memory; polymer data storage; magnetic states in antiferromagnets.
Research Bits: Jan. 7
Deep UV microLED for maskless lithography; avalanching nanoparticles for optical computing; Probabilistic computing with stochastic spintronics.
