Chip Industry Technical Paper Roundup: June 17
HBM roadmap from KAIST; RISC-V base station-on-chip; fully automated processor design; analysis of LLMs on HDL-based communication protocol generat...
Research Bits: June 17
Enabling 6G: Superlattice castellated FETs; compact phased-array transceiver; RF GaN-on-Si transistor.
Research Bits: June 9
InGaOx GAA transistor; 2D hybrid glaphene; simulating plasma.
Chip Industry Technical Paper Roundup: June 9
Customizing a LLM for VHDL design; HW-centric analysis of DeepSeek's multi-head latent attention; high-density polymer waveguides with silicon phot...
Chip Industry Technical Paper Roundup: June 3
Chiplet to chiplet communication; SRAM scaling with monolithic 3D integration of 2D FETs; scan instrumentation for post-silicon test; photonic HW o...
Research Bits: June 3
Magnetic sensing: Imaging power electronics; hexagonal boron nitride; nuclear spin microscopy.
Chip Industry Technical Paper Roundup: May 28
Confidential computing for eRISC-V; SEM automatic defect inspection; energy-aware DL on resource-constrained HW; transforming 2DICs into 3DICs usin...
Research Bits: May 27
Tracking ferroelectric domain walls; selenium nanowires; semiconducting silicone.
Chip Industry Technical Paper Roundup: May 20
Reducing stress in chiplets; CFETs beyond 3nm; RISC-V eGPUs for TinyAI; LLM for VHDL MPU design; cache side-channel attacks on LLMs; memory prefetc...
Research Bits: May 20
Smart fabrics: Sensing with acoustic waves; 3D printed softer textiles; double-helical fiber sensor.
