Research Bits: Jan. 13
High-temp electrochemical memory; polymer data storage; magnetic states in antiferromagnets.
Research Bits: Jan. 7
Deep UV microLED for maskless lithography; avalanching nanoparticles for optical computing; Probabilistic computing with stochastic spintronics.
Chip Industry Technical Paper Roundup: Jan. 7
Processing-in-DRAM; co-packaged optics; SOT-MRAM development; efficient wearables; open-source heterogeneous SoCs for AI; Cu–Cu bonding reliabili...
Research Bits: Dec. 24
Growing multilayered chips; atomic-scale diamond processing; memristor effect in OFET.
Chip Industry Technical Paper Roundup: Dec. 23
Memory at extreme temps; CXL to optimize bandwidth; partitioned security monitoring; impact of aging on clock tree design; materials beyond Si; 98 ...
Research Bits: Dec. 16
Flexible electronics: Soft liquid metal vias; stretchable TENG; thermoelectric film.
Research Bits: Dec. 11
Photonic AI processor; optoelectronic physical reservoir computing; optical programmable logic array.
Research Bits: Dec. 3
Self-assembly of mixed-metal oxide arrays; biodegradable thin-film devices; hexagonal boron nitride films.
Chip Industry Technical Paper Roundup: Dec. 3
Pooling CPU memory for LLM inference; high-bandwidth chiplet interconnects for adv. packaging; dense edge architectures; spiking neuromorphic HW; G...
Chip Industry Technical Paper Roundup: Nov. 25
Liquid cooling; spiking transformer accelerators; sustainable HW specialization; GAA-NSFETs; roadmap for Schottky barrier transistors; encrypting S...
