category: Top Stories

category: IoT, Security & Automotive

Design For Advanced Packaging
By Brian Bailey - 08 Nov, 2018 - Comments: 0

Advanced packaging techniques are viewed as either a replacement for Moore's Law scaling, or a way of augmenting it. But there is a big gap between the extensive work done to prove these devices can be manufactured with sufficient yield and the amount of attention being paid to the demands advanced packaging has on the design and verification flows. Not all advanced packaging places the same... » read more

Taming NBTI To Improve Device Reliability
By Ann Steffora Mutschler - 08 Nov, 2018 - Comments: 0

Negative-bias temperature instability is a growing issue at the most advanced process nodes, but it also has proven extremely difficult to tame using conventional approaches. That finally may be starting to change. NBTI is an aging mechanism in field-effect transistors that leads to a change of the characteristic curves of a transistor during operation. The result can be a drift toward unint... » read more

Computing Way Outside Of A Box
By Ed Sperling - 08 Nov, 2018 - Comments: 0

Mike Muller, CTO of Arm, sat down with Semiconductor Engineering to talk about changing boundaries between client and server machines, the end of Moore's Law and the impact of machine learning on chip architectures. What follows are excerpts of that conversation. SE: Are the lines blurring between what's considered a client device and what's considered a server? Muller: It's less about a ... » read more

Are Devices Getting More Secure?
By Ed Sperling and Kevin Fogarty - 07 Nov, 2018 - Comments: 1

Adding security into chip design is becoming more prevalent as more devices are connected to the Internet, but it's not clear whether that is enough to offset an explosion in connected "things." Security concerns have been growing for the past half-decade, starting with a rash of high-profile attacks on retail establishments, hotel membership clubs, and Equifax, one of the three top credit-c... » read more

Panel Fan-out Ramps, Challenges Remain
By Mark LaPedus - 05 Nov, 2018 - Comments: 0

After years of R&D, panel-level fan-out packaging is finally beginning to ramp up in the market, at least in limited volumes for a few vendors. However, panel-level fan-out, which is an advanced form of today’s fan-out packaging, still faces several technical and cost challenges to bring this technology into the mainstream or high-volume manufacturing. Moreover, several companies are d... » read more

Testing Millimeter Wave for 5G
By Susan Rambo - 05 Nov, 2018 - Comments: 0

By Susan Rambo and Ed Sperling The telecommunications world is hurtling toward 5G, but there is no consistency about how this next-gen wireless technology will be rolled out across various regions and plenty of unknowns about how it will be tested and how reliable it will be initially. A fair amount of confusion exists around what 5G constitutes in the first place. There is sub-6GHz 5G, w... » read more

The Big Data Shift Has Started
By Ed Sperling - 05 Nov, 2018 - Comments: 0

Terry Brewer, president and CEO of Brewer Science, sat down with Semiconductor Engineering to talk about different priorities for private and public companies, why AI completely changes the game for technology companies, and what impact materials will have on innovation and design in the future. SE: What are the next big opportunities for Brewer Science? Brewer: There are broad opportunit... » read more

October Startup Funding: IoT, Security, Auto
By Jeff Dorsch - 02 Nov, 2018 - Comments: 0

Billions were raised in October for Internet of Things, cybersecurity, automotive electronics, and related technology startups. Automotive October fundings rolled in on the automotive side for Israel’s VayaVision ($8 million) and South Korea-based SOS LAB ($6 million Series A), which are developing products for autonomous vehicles. Silicon Mobility ($10 million Series B), a French startup... » read more

AI Begins To Reshape Chip Design
By Ed Sperling - 01 Nov, 2018 - Comments: 1

Artificial intelligence is beginning to impact semiconductor design as architects begin leveraging its capabilities to improve performance and reduce power, setting the stage for a number of foundational shifts in how chips are developed, manufactured and updated in the future. AI—and machine learning and deep learning subsets—can be used to greatly improve the functional control and pow... » read more

Connected Cars: From Chip To City
By Ann Steffora Mutschler - 01 Nov, 2018 - Comments: 0

As the automotive industry moves closer to autonomous vehicles, ecosystem players are focusing on the infrastructure pieces needed to make autonomous technology a reality for the first adopters, which are most likely commercial fleets. Vehicle-to-infrastructure (V2I or v2i) is a communications model that allows vehicles to share information with the components that support a country's hi... » read more

← Older posts

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2018 SMG   |  Terms of Service  |  Privacy Policy