category: Top Stories

category: Auto, Security & Edge AI

From Highways To Health Care: Portability Proves Key To Physical AI
By Laura Peters - 22 Jul, 2026 - Comments: 0

Key Takeaways: Hyperspectral imaging is making a difference in surgery, disease diagnostics, and water conservation. Inverse lithography technology (ILT) finds a new application in reticle stitching. Leaders are porting learnings from the Automotive Chiplet Program to the Autonomous Edge Chiplet Program. With a healthy boost from AI and high-performance compute, medical devi... » read more

Data Center Chokepoints Tied To AI, Political Pressure, Supply Chain
By Brendan Heffernan - 20 Jul, 2026 - Comments: 0

Key Takeaways: AI-driven compute demands have led to several distinct supply chain bottlenecks for data centers. With data center energy demand surging faster than the grid can scale, small nuclear power has quickly moved to the center of the conversation. Hyperscalers have leaned into specialized facility design to meet their challenges, leading to an increasingly fragmented semicon... » read more

Can Fine-Pitch Hybrid Bonding Go High Volume?
By Gregory Haley - 16 Jul, 2026 - Comments: 0

Key Takeaways: Fine-pitch hybrid bonding extends a proven production technology into a manufacturing regime with much smaller margins for particles, surface variation, distortion, and placement error. Die-to-wafer integration allows known-good-die selection, but it exchanges wafer-level parallelism for repeated handling, alignment, and bonding operations. Reaching high volume will de... » read more

New Nonvolatile Memory Winners Emerge
By Bryon Moyer - 16 Jul, 2026 - Comments: 0

Key Takeaways:  MRAM and RRAM will likely coexist, each with a different focus. PCRAM isn’t being ported onto finFET nodes. FeRAM is seeing new life, while a newcomer has a new NVM bit cell. Newer nonvolatile memory (NVM) technologies are poised to take over from flash in embedded applications on newer process nodes. Magnetic RAM (MRAM) and resistive RAM (RRAM) appear to ... » read more

Alternative Materials For Hybrid Bonding
By Katherine Derbyshire - 16 Jul, 2026 - Comments: 0

Key Takeaways:  Hybrid bonding is essential for the interconnect density that high-bandwidth workloads require. Successful implementation depends on control of surface chemistry and surface topography — clean surfaces with topography that can accommodate expansion during bonding. To improve interface quality and manage stresses related to thermal expansion mismatch, manufacturers ... » read more

AI In Chip Design: Lots Of Promise, Plenty Of Unanswered Questions
By Ed Sperling - 15 Jul, 2026 - Comments: 0

Key Takeaways: AI opens the door to exploring a much larger solution space, similar to what high-level synthesis did years ago, but questions persist about the impact of increasing reliance on what is essentially a black-box chip design. There is no consistent answer to how successful AI will be, where it will succeed or fail, or how it will apply to different markets and EDA customers.... » read more

Startup Funding: Q2 2026
By Jesse Allen - 13 Jul, 2026 - Comments: 0

Investors kept pouring money into AI hardware startups in the second quarter of 2026. While companies focused on chips for AI data centers have largely dominated the funding over the past year, startups creating edge silicon re-emerged this quarter as investors see the appeal of physical AI and real-time on-device applications. However, large-scale AI infrastructure chips and other attendant as... » read more

AI Is Rewriting The IP Playbook
By Ann Mutschler - 09 Jul, 2026 - Comments: 0

Key Takeaways:  AI is reshaping the entire IP lifecycle, from creation and verification to discovery, licensing, and support.  Fast-changing AI models are making flexible IP, robust toolchains, and faster deployment essential.  Human expertise remains critical for reviewing, validating, and governing AI-assisted IP development.  AI is becoming part of the everyday work o... » read more

Where Does Quantum Computing Stand?
By Bryon Moyer - 09 Jul, 2026 - Comments: 0

Key Takeaways:  Quantum technology is seeing very active development, but most commercial offerings remain years away.  QED-C represents the industry and provides reports and roadmaps.  The three main elements that need definition are the qubit, error correction, and software, both for control and for algorithms.  Quantum computing has imprinted itself on our society as ... » read more

An AI Model Fit For Purpose
By Brian Bailey - 09 Jul, 2026 - Comments: 0

Key takeaways A model can only be used for its intended purpose, in a defined context, without taking unknown risks.  Models must be created using a well-defined process and verified in a way that provides a level of independence.  Deployment requires trust and a way to track the properties of the model. A model captures some kind of behavior exhibited in the real world, b... » read more

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