Embedded Phase-Change Memory Emerges


The next-generation memory market for embedded applications is becoming more crowded as another technology emerges in the arena—embedded phase-change memory. Phase-change memory is not new and has been in the works for decades. But the technology has taken longer to commercialize amid a number of technical and cost challenges. Phase-change memory, a nonvolatile memory type that stores data... » read more

What’s Next For AI, Quantum Chips


Semiconductor Engineering sat down to discuss the latest R&D trends with Luc Van den hove, president and chief executive of Imec; Emmanuel Sabonnadière, chief executive of Leti; and An Chen, executive director for the Nanoelectronics Research Initiative at the Semiconductor Research Corp. (SRC). Chen is on assignment from IBM. What follows are excerpts of those conversations, which took pl... » read more

The Data Deluge


Lip-Bu Tan, president and CEO of Cadence, sat down with Semiconductor Engineering to discuss the intersection of big data and technology, from the data center to the edge and vertical markets such as automotive. What follows are excerpts of that conversation. SE: What are the biggest changes you've seen over the past year? Tan: We are moving quickly toward data-driven economics. There... » read more

Planning For 5G And The Edge


Semiconductor Engineering sat down to discuss 5G and edge computing with Rahul Goyal, vice president in the technology and manufacturing group at Intel; John Lee, vice president and general manager of the semiconductor business unit at ANSYS; Rob Aitken, R&D fellow at Arm; and Lluis Paris, director of IP portfolio marketing at TSMC. What follows are excerpts of that conversation. Part one i... » read more

Taming Concurrency


Concurrency adds complexity for which the industry lacks appropriate tools, and the problem has grown to the point where errors can creep into designs with no easy or consistent way to detect them. In the past, when chips were essentially a single pipeline, this wasn't a problem. In fact, the early pioneers of EDA created a suitable language to describe and contain the necessary concurrency ... » read more

Mostly Upbeat Outlook For Chips


2019 has started with cautious optimism for the semiconductor industry, despite dark clouds that dot the horizon. Market segments such as cryptocurrencies and virtual reality are not living up to expectations, the market for smart phones appears to be saturated, and DRAM prices are dropping, leading to cut-backs in capital expenditures. EDA companies are talking about sales to China being pu... » read more

Process Variation And Aging


Semiconductor Engineering sat down to discuss design reliability and circuit aging with João Geada, chief technologist for the semiconductor business unit at ANSYS; Hany Elhak, product management director, simulation and characterization in the custom IC and PCB group at Cadence; Christoph Sohrmann, advanced physical verification at Fraunhofer EAS; and Naseer Khan, vice president of sales at M... » read more

AI’s Growing Impact On Chip Design


Synopsys chairman and co-CEO Aart de Geus sat down with Semiconductor Engineering to talk about the rapid infusion of AI into electronics, how that is changing chip design and the software that runs on those chips. What follows are excerpts of that conversation. SE: We're dealing with a bunch of new markets, more customized design, and AI seems to be creeping into everything. How does this i... » read more

Machine Learning For IC Production


Semiconductor Engineering sat down to discuss artificial intelligence (AI), machine learning, and chip and photomask manufacturing technologies with Aki Fujimura, chief executive of D2S; Jerry Chen, business and ecosystem development manager at Nvidia; Noriaki Nakayamada, senior technologist at NuFlare; and Mikael Wahlsten, director and product area manager at Mycronic. What follows are excerpt... » read more

More 2.5D/3D, Fan-Out Packages Ahead


A new wave of 2.5D/3D, fan-out and other advanced IC packages is expected to flood the market over the next year. The new packages are targeted to address many of the same and challenging applications in the market, such as multi-die integration, memory bandwidth issues and even chip scaling. But the new, advanced IC packages face some technical challenges. And cost remains an issue as advan... » read more

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