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category: Top Stories

category: IoT, Security & Automotive

Advanced Packaging For Automotive Chips
By Ann Steffora Mutschler - 02 Dec, 2021 - Comments: 0

Multiple types of chips may be better than one for dealing with large amounts and different types of data, but in automotive applications it's not entirely clear how or even whether they should be packaged together. The biggest problem with electronics in vehicles is the extreme range of temperatures, both within and outside of vehicles. Without adequate cooling, chips can age prematurely, s... » read more

Will Markets For ML Models Materialize?
By Bryon Moyer - 02 Dec, 2021 - Comments: 0

Developers are spending increasing amounts of time and effort in creating machine-learning (ML) models for use in a wide variety of applications. While this will continue as the market matures, at some point some of these efforts might be seen as reinventing models over and over. Will developers of successful models ever have a marketplace in which they can sell those models as IP to other d... » read more

Startup Funding: November 2021
By Jesse Allen - 01 Dec, 2021 - Comments: 0

There's nothing virtual about the level of interest in AR/VR startups. As the concept of the 'metaverse' becomes more widespread with Nvidia's recent GTC announcements and Facebook's rebranding, investors poured money into startups with enabling technology for augmented, virtual, and extended reality. Most of those are developing waveguides and other display technology that is light enough to b... » read more

Product Lifecycle Management For Semiconductors
By Brian Bailey - 23 Nov, 2021 - Comments: 1

Product lifecycle management (PLM) and the semiconductor industry have always been separate, but pressure is growing to integrate them. Automotive, IIoT, medical, and other industries see that as the only way to manage many aspects of their business, and as it stands, semiconductors are a large black box in that methodology. The technology space is driven by a mix of top down and bottom-up p... » read more

Advanced Packaging Shifts Design Focus To System Level
By Ann Steffora Mutschler - 23 Nov, 2021 - Comments: 0

Growing momentum for advanced packaging is shifting design from a die-centric focus toward integrated systems with multiple die, but it's also straining some EDA tools and methodologies and creating gaps in areas where none existed. These changes are causing churn in unexpected areas. For some chip companies, this has resulted in a slowdown in hiring of ASIC designers and an uptick in new jo... » read more

Gaps In The AI Debug Process
By Brian Bailey - 23 Nov, 2021 - Comments: 0

When an AI algorithm is deployed in the field and gives an unexpected result, it's often not clear whether that result is correct. So what happened? Was it wrong? And if so, what caused the error? These are often not simple questions to answer. Moreover, as with all verification problems, the only way to get to the root cause is to break the problem down into manageable pieces. The semico... » read more

End In Sight For Chip Shortages?
By Mark LaPedus - 18 Nov, 2021 - Comments: 0

The current wave of semiconductor and IC packaging shortages is expected to extend well into 2022, but there are also signs that supply may finally catch up with demand. The same is true for manufacturing capacity, materials and equipment in both the semiconductor and packaging sectors. Nonetheless, after a period of shortages in all segments, the current school of thought is that chip suppl... » read more

The Race To Make Better Qubits
By Katherine Derbyshire - 18 Nov, 2021 - Comments: 0

One of the big challenges in quantum computing is getting qubits to last long enough to do something useful with them. After decades of research, there now appears to be tangible progress. The challenge with any new semiconductor technology is to improve performance by one or more orders of magnitude without discarding a half-century of progress in other areas. Qubits based on silicon quantu... » read more

A Broad Look Inside Advanced Packaging
By Mark LaPedus - 18 Nov, 2021 - Comments: 0

Choon Lee, chief technology officer of JCET, sat down with Semiconductor Engineering to talk about the semiconductor market, Moore’s Law, chiplets, fan-out packaging, and manufacturing issues. What follows are excerpts of that discussion. SE: Where are we in the semiconductor cycle right now? Lee: If you look at 2020, it was around 10% growth in the overall semiconductor industry. ... » read more

Zonal Architectures Play Key Role In Vehicle Security
By Ann Steffora Mutschler - 17 Nov, 2021 - Comments: 0

The automotive ecosystem is starting to shift toward zonal architectures, making vehicle functionality less dependent on the underlying hardware and allowing more flexibility in what gets processed where. The impact of that shift is both broad and significant. For carmakers, it could lead to hardware consolidation and more options for failovers in case something goes wrong with any system in... » read more

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