IoT Startups Rake In Cash


Corporate and venture investors are still eagerly backing Internet of Things startups, with more than $850 million committed during the first six months of 2017. This year’s total may not reach the heights of 2014, when investors put more than $5 billion into IoT startups, or 2016, which saw IoT firms receiving about $4.75 billion, the Venture Scanner website estimates. Still, a once white... » read more

Rethinking Car Design


The automotive industry is undergoing sweeping changes in both technology and business, and functional safety increasingly cuts across both of them. Every safety-critical industry has one or more functional safety standards, whether that is manufacturing, avionics or automotive. In automotive, it's a combination of [gettech id="31076" comment="ISO 26262"] and various ASIL levels, which are a... » read more

When Digital, Physical Worlds Merge


Semiconductor Engineering sat down with Simon Segars, [getentity id="22186" e_name="ARM's"] CEO, and [getperson id="11764" comment="Lucio Lanza"], managing partner of Lanza techVentures, to talk about changes in the IoT, self-driving vehicles, cloud-based health monitoring, and the impact of machine learning. What follows are excerpts of this conversation. SE: Several years ago the [getkc i... » read more

The Darker Side Of Machine Learning


Machine learning can be used for many purposes, but not all of them are good—or intentional. While much of the work underway is focused on the development of machine learning algorithms, how to train these systems and how to make them run faster and do more, there is a darker side to this technology. Some of that involves groups looking at what else machine learning can be used for. So... » read more

Verification Unification


Semiconductor Engineering brought together industry luminaries to initiate the discussion about the role that formal technologies will play with the recently released early adopter's draft of Portable Stimulus and how it may help to bring the two execution technologies closer together. Participating in this roundtable are Joe Hupcey, verification product technologist for [getentity id="22017" e... » read more

Machine Learning Meets IC Design


Machine Learning (ML) is one of the hot buzzwords these days, but even though EDA deals with big-data types of issues it has not made much progress incorporating ML techniques into EDA tools. Many EDA problems and solutions are statistical in nature, which would suggest a natural fit. So why is it so slow to adopt machine learning technology, while other technology areas such as vision recog... » read more

Verification In The Cloud


By Ed Sperling Leasing of cloud-based verification resources on an as-needed basis is finally beginning to gain traction after more than a decade of false starts and over-optimistic expectations. All of the major EDA vendors now offer cloud-based services. They view this as a way of either supplementing a chipmaker's existing resources at various peak use times, or for small and midsize com... » read more

Verification And The IoT


Semiconductor Engineering sat down to discuss what impact the IoT will have on the design cycle, with Christopher Lawless, director of external customer acceleration in [getentity id="22846" e_name="Intel"]'s Software Services Group; David Lacey, design and verification technologist at Hewlett Packard Enterprise; Jim Hogan, managing partner at Vista Ventures; Frank Schirrmeister, senior group d... » read more

Connecting The Car


K. Charles Janac, chairman and CEO of ArterisIP, sat down with Semiconductor Engineering to discuss changes in automotive and how the connected car will affect chip design and a multitude of other markets. What follows are excerpts of that conversation. SE: What is the biggest change you're seeing in semiconductors? Janac: The really big change is that mobility is flattening out. The mark... » read more

Shrink Or Package?


Advanced packaging is rapidly becoming a mainstream option for chipmakers as the cost of integrating heterogeneous components on a single die continues to rise. Despite several years of buzz around this shift, the reality is that it has taken more than a half-century to materialize. Advanced [getkc id="27" kc_name="packaging"] began with IBM flip chips in the 1960s, and it got another boost ... » read more

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