What Happened To UPF?


Two years ago there was a lot of excitement, both within the industry and the standards communities, about rapid advancements that were being made around low-power design, languages and methodologies. Since then, everything has gone quiet. What happened? At the time, it was reported that the [gettech id="31043" comment="IEEE 1801"] committee was the largest active committee within the IEEE. ... » read more

Processing Moves To The Edge


Edge computing is evolving from a relatively obscure concept into an increasingly complex component of a distributed computing architecture, in which processing is being shifted toward end devices and satellite data facilities and away from the cloud. Edge computing has gained attention in two main areas. One is the [getkc id="78" kc_name="industrial IoT"], where it serves as a do-it-yoursel... » read more

High-Performance Memory Challenges


Designing memories for high-performance applications is becoming far more complex at 7/5nm. There are more factors to consider, more bottlenecks to contend with, and more tradeoffs required to solve them. One of the biggest challenges is the sheer volume of data that needs to be processed for AI, machine learning or deep learning, or even in classic data center server racks. “The design... » read more

Built-In Security For Auto Chips


The road to autonomous vehicles depends upon components that are secured against hacking and other outside interference. The cybersecurity precautions necessary for self-driving cars must be embedded in chips and systems from the beginning of the supply chain. Automotive manufacturers and their Tier 1 suppliers are counting on their electronics vendors to provide products that can withst... » read more

Choosing The Right Interconnect


Efforts to zero in on cheaper advanced packaging approaches that can speed time to market are being sidetracked by a dizzying number of choices. At the center of this frenzy of activity is the [getkc id="36" kc_name="interconnect"]. Current options range from organic, silicon and glass interposers, to bridges that span different die at multiple levels. There also are various fan-out approach... » read more

Embedded Die Packaging Emerges


Embedded die packaging is seeing renewed demand amid the push towards chips and systems that require smaller form factors. ASE, AT&S, GE, Shinko, Taiyo Yuden, TDK, Würth Elektronik and others compete in the merchant embedded die packaging market, according to Yole Développement. In fact, ASE and TDK have a joint venture in the arena, which is beginning to ramp up production. Additional... » read more

Wireless Test Faces New Challenges


Your mobile phone is far more complex than it was even five years ago, and it’s about to become even more complex with new wireless technologies. That has set off a scramble among test equipment vendors to come up with solutions, methodologies and equipment that is affordable, effective and reliable enough to make sure all of this technology works as planned—and that it continues to work th... » read more

New Shifts In Automotive Design


Four big shifts in automotive design and usage are beginning to converge—electrification, increasing connectivity, autonomous driving and car sharing—creating a ripple effect across the automotive electronics supply chain. Over the past few years the electronic content of cars and other vehicles has surged, with electrical systems replacing traditional mechanical and electro-mechanical s... » read more

Where Is Energy Harvesting?


With power management a top priority in sensor networks, why is energy harvesting—a proven technology with diverse energy sources—conspicuously absent from sensor designs that are the foundation of the Internet of Things? [getkc id="165" kc_name="Energy harvesting"] always has been a promising answer to the limits of battery power. The idea that a device can run for much longer periods o... » read more

EDA: 8 Consecutive Years Of Growth


The Electronic System Design (ESD) Alliance Market Statistics Service (MSS) reported today that revenue for Electronic Design Automation (EDA) industry increased 10.7 percent for Q4 2017 to $2718.6 million, compared to $2455 million in Q4 2016. The four-quarters moving average was up by 9.5 percent. This compares the most recent four quarters to the prior four quarters. "It was a terrific qu... » read more

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