category: Top Stories

category: IoT, Security & Automotive

Data Coherence Across Silos And Hierarchy
By Brian Bailey - 27 Jun, 2024 - Comments: 0

Shift left has become a rallying cry for the chip design industry, but unless coherent data can flow between the groups being impacted, the value may not be as great as expected. Shift left is a term that encompasses attempts to bring analysis and decision-making forward in the development process. The earlier an issue can be found, the less of a problem it ultimately becomes. But in many ca... » read more

Design Flow Challenged By 3D-IC Process, Thermal Variation
By Karen Heyman - 27 Jun, 2024 - Comments: 0

3D-ICs are proving a challenge even for designers accustomed to dealing with power and performance tradeoffs, but they are considered an inevitable migration path for leading-edge designs due to the compute demands of AI and the continual shrinking of digital logic. 3D-ICs are widely viewed as the way to continue scaling beyond the limits of planar SoCs, and a way to add more heterogeneous d... » read more

Moving Software-Defined Vehicles Forward
By Ann Mutschler - 26 Jun, 2024 - Comments: 0

Experts at the Table: The automotive ecosystem is undergoing a transformation toward software-defined vehicles, spurring new architectures with more software. Semiconductor Engineering sat down to discuss the impact of these changes with Suraj Gajendra, vice president of products and solutions in Arm's automotive line of business; Chuck Alpert, R&D automotive fellow at Cadence; Steve Spadon... » read more

U.S. Proposes Restrictions On Tech Investments In China
By Linda Christensen - 24 Jun, 2024 - Comments: 1

The U.S. proposed new regulations to curtail American investments in Chinese technologies that pose a national security threat, specifically calling out semiconductors and microelectronics, quantum information technologies, and AI. The draft regulations come nearly a year after the Biden administration issued an executive order prohibiting investments in sensitive technologies used to accele... » read more

Controlling Warpage In Advanced Packages
By Laura Peters - 24 Jun, 2024 - Comments: 1

Warpage is becoming a serious concern in advanced packaging, where a heterogeneous mix of materials can cause uneven stress points during assembly and packaging, and under real workloads in the field. Warpage plays a critical role in determining whether an advanced package can be assembled successfully and meet long-term reliability targets. New advances, such as molding compounds with impro... » read more

Single Vs. Multi-Patterning Advancements For EUV
By Gregory Haley - 20 Jun, 2024 - Comments: 0

As semiconductor devices become more complex, so do the methods for patterning them. Ever-smaller features at each new node require continuous advancements in photolithography techniques and technologies. While the basic lithography process hasn’t changed since the founding of the industry — exposing light through a reticle onto a prepared silicon wafer — the techniques and technology ... » read more

Precise Control Needed For Copper Plating And CMP
By Anne Meixner - 20 Jun, 2024 - Comments: 0

Chipmakers are relying on machine learning for electroplating and wafer cleaning at leading-edge process nodes, augmenting traditional fault detection/classification and statistical process control in order to extend the usefulness of copper interconnects. Copper is well understood and easy to work with, but it is running out of steam. At 5nm and below, copper plating tools are struggling to... » read more

Ruthenium Interconnects On Tap
By Katherine Derbyshire - 20 Jun, 2024 - Comments: 0

Chipmakers' focus on new interconnect technology is ramping up as copper's effectiveness continues to diminish, setting the stage for a significant shift that could improve performance and reduce heat at future nodes and in advanced packages. The introduction of copper interconnects in 1997 upended the then-standard tungsten via/aluminum line metallization scheme. Dual damascene integration ... » read more

What’s Missing In Test
By Anne Meixner - 19 Jun, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss how functional test content is brought up at first silicon, and the balance between ATE and system-level testing, with Klaus-Dieter Hilliges, V93000 platform extension manager at Advantest Europe; Robert Cavagnaro, fellow in the Design Engineering Group at Intel (responsible for manufacturing and test strategy of data center... » read more

IC Industry’s Growing Role In Sustainability
By Ann Mutschler - 17 Jun, 2024 - Comments: 1

The massive power needs of AI systems are putting a spotlight on sustainability in the semiconductor ecosystem. The chip industry needs to be able to produce more efficient and lower-power semiconductors. But demands for increased processing speed are rising with the widespread use of large language models and the overall increase in the amount of data that needs to be processed. Gartner estima... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy