category: Top Stories

category: Auto, Security & Edge AI

GaN Power Devices Go Vertical
By Katherine Derbyshire - 18 Jun, 2026 - Comments: 0

Key Takeaways: On paper, GaN is an excellent candidate for high-voltage power applications. That potential has been difficult to realize due to the lack of sufficiently high-quality starting material. In particular, high-voltage applications require vertical designs. Recent advances in GaN growth are making these designs more feasible. Promising designs and complete process flows hav... » read more

Designing Chips That Can Explain Themselves
By Ann Mutschler - 17 Jun, 2026 - Comments: 1

Key Takeaways: On-die telemetry gives architects a path to replace worst-case design margin with measured silicon behavior, improving PPA without compromising resilience. As monitor density and control-loop speed increase, observability must be architected hierarchically across local hardware response, on-die processing, and fleet-level learning. The real payoff is architectural: str... » read more

Wi-Fi Flies Higher As Edge AI Build-Out Takes Root
By Ed Sperling - 15 Jun, 2026 - Comments: 0

Key Takeaways: Wi-Fi 7 is becoming an essential technology for edge AI, and subequent demands for even better reliability will grow as the edge build-out takes shape. Edge computing is based on the assumption that more data will be processed and stored locally, which will help reduce data leakage and theft. The big challenge ahead will be orchestrating data movement across different ... » read more

Agentic AI Is Changing Data Center Architectures
By Ann Mutschler - 11 Jun, 2026 - Comments: 0

Key Takeaways: The rise of agentic AI is shifting data centers from GPU-centric number crunching to CPU-driven orchestration, where managing long-running reasoning loops and context is just as important as raw compute. Integrating CPUs, GPUs, and stacked memory into tightly coupled multi-die architectures with varying workloads makes it much harder to ensure they will be reliable and ef... » read more

Can AI Create Missing Models?
By Brian Bailey - 11 Jun, 2026 - Comments: 0

Key takeaways Models are an essential part of EDA flows, each capturing necessary detail while retaining good execution performance. Models have been expensive to create, maintain and verify, restricting their utilization, but AI may be able to significantly reduce their cost. A deeper question remains. Should AI be used to create models that help existing flows, or should AI be used... » read more

PCIe Benefits From AI, Despite Scaling Protocols
By Bryon Moyer - 10 Jun, 2026 - Comments: 0

Key takeaways: PCIe remains a critical technology for non-AI processing. For AI, PCIe will be strengthened by scale-out, agentic AI, and even some scale-up. CXL is seeing uptake, and some even think it could participate in AI processing. PCIe has been the go-to network for most data traffic moving from a processor to devices located elsewhere, which is also what the new data... » read more

AI Models Transform Defect Inspection And Review, But Can Fail To Scale
By Laura Peters - 09 Jun, 2026 - Comments: 0

Key Takeaways: AI plays a role in improving defect capture rate and distinguishing between yield-killing and nuisance defects. New developments in wafer edge inspection are proving essential to bonded wafer yields. 70% of AI initiatives stall after pilot implementation, but some pitfalls can be avoided. One of the brightest spots in AI use today is the industry’s ability t... » read more

Why Analog And Mixed-Signal Chips Resist Adaptive Test
By Gregory Haley - 09 Jun, 2026 - Comments: 0

Key Takeaways Analog and mixed-signal test remains heavily specification-based because the measurements do not always produce a single expected result. The absence of objective coverage metrics has historically encouraged conservative test flows, which IEEE 2427-2025 begins to address. Separating device behavior from test-path variation is a prerequisite for any adaptive flow—and h... » read more

Co-Packaged Optics Testing Faces Steep Data Center Ramp
By Anne Meixner - 09 Jun, 2026 - Comments: 0

Key Takeaways: Device interface board must balance flexibility in handling with customization for different optical connectors. Test fixtures should account for DUT socketing challenges, such as warpage, coupling, and interference. Advanced data management practices will help speed yield learning. Integrating photonic and electrical ICs into co-packaged optics (CPO) requires... » read more

Orbital Data Centers Are Souped-Up Satellites – For Now
By Liz Allan - 04 Jun, 2026 - Comments: 0

Key Takeaways: Today’s orbital data centers are better described as compute centers in space, as they resemble satellite constellations more than terrestrial data centers. The most common power solution is sun-synchronous solar at the poles, but this requires a multi-hop data relay from power-hungry compute to standard satellite constellations in the low-orbit mesh, then to Earth. ... » read more

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