category: Top Stories

category: Auto, Security & Edge AI

Keeping Security Algorithms Current Is Getting Harder
By Ann Mutschler - 04 Jun, 2026 - Comments: 0

Key Takeaways: Keeping security algorithms current is now a lifecycle challenge that spans chip design, manufacturing, deployment, and long-term maintenance across the supply chain. To stay ahead of emerging threats — especially post-quantum risks — hardware must be built with cryptographic agility, secure roots of trust, and reliable update mechanisms from the start. The bigge... » read more

AI-Defined Vehicles Increase Pressure On Auto Ethernet Reliability
By Liz Allan - 04 Jun, 2026 - Comments: 0

Key Takeaways: For AI-defined vehicles and onboard agentic AI, Automotive Ethernet provides high bandwidth for sensor data fusion, TSN ensures low latency and synchronization for real-time decisions, and MACsec secures the data link. Time-sensitive networking (TSN) is an essential protocol for ensuring 10BASE-T1S delivers data to where it needs to go on time. Still, it becomes less esse... » read more

GaN Power Devices Power Up
By Katherine Derbyshire - 03 Jun, 2026 - Comments: 0

Key Takeaways: GaN devices are gaining traction due to their ability to tolerate higher voltages. New approaches such as chiplets offer faster switching with less loss. The first applications to benefit from GaN will be low-voltage consumer devices; industrial applications require more work. As electrical power displaces fossil fuels in more applications, system designers ne... » read more

The Sub-2nm Paradox
By Ed Sperling - 01 Jun, 2026 - Comments: 2

Key Takeaways: Process variation and physics are changing semiconductor design, manufacturing, and economics at 2nm and below. Even though new manufacturing processes are being introduced, it's taking longer for them to mature. The focus for many chip designs is faster data movement and more efficient computing, rather than just relying on more transistors per mm2. At 2nm an... » read more

Swapping Out Chiplets: I/Os Vs. Compute
By Liz Allan - 28 May, 2026 - Comments: 0

Key Takeaways: Companies can save time and money by swapping out a compute, memory, or I/O chiplet to gain technology improvements, while keeping the other dies stable. Chip architects may choose to keep their I/Os stable and swap out compute to move from a 5nm process node to 3nm to achieve performance and power improvements, or swap out memory from LPDDR5X to LPDDR6. Swapping out... » read more

Toward Agentic Verification
By Brian Bailey - 28 May, 2026 - Comments: 1

Key Takeaways: Agentic verification provides flow orchestration for common repetitive tasks. Capabilities will expand when tools can learn from a larger context, including the specification. Design houses need to fully understand the costs and benefits and plan accordingly. Agentic verification is more than a buzzword. It is a pivotal moment in the evolution of verification ... » read more

Observability Is Essential For Modern Silicon
By Ann Mutschler - 28 May, 2026 - Comments: 0

Experts At The Table: In-silicon observability — also known as on-die or on-chip visibility — is becoming increasingly important for managing the performance, reliability, and security of today’s high-performance systems. Semiconductor Engineering sat down to discuss this with Andy Nightingale, vice president of product management and marketing at Arteris; Nandan Nayampally, chief commerc... » read more

Curvilinear Masks Push The Limits Of Inspection And Metrology
By Gregory Haley - 27 May, 2026 - Comments: 0

Key Takeaways: Curvilinear masks require native data flows across design, mask data prep, writing, inspection, and metrology. Inspection is shifting from finding all defects to identifying which mask variations actually print on wafer. High-NA EUV will intensify inspection challenges, particularly for small printable defects and actinic contrast limits. Experts at the table... » read more

With Chiplets, What Role Does Economics Play?
By Bryon Moyer - 21 May, 2026 - Comments: 1

Key Takeaways: For the data center, chiplet economics matter, but they’re not a primary decision-driver. With the exception of processor families, chiplets cannot address consumer markets today, where economics dominate. If a chiplet marketplace materializes, the economics may be friendlier because chiplets will have multiple customers and applications. Chiplets are notori... » read more

Low-Temp Solders Are Suddenly Critical For Chiplets And Photonics
By Laura Peters - 21 May, 2026 - Comments: 0

Key Takeaways: Tin-bismuth-based solders enable reduced warpage and compatibility with silicon photonics and other temperature-sensitive components. A novel soldering process using white light could help prevent cracks in flip-chip BGA package solder balls, while reducing the carbon footprint. Hypoeutectic Sn-Bi based solders prove especially promising as an SAC305 replacement. ... » read more

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