category: Top Stories

category: IoT, Security & Automotive

Identifying Sources Of Silent Data Corruption
By Laura Peters - 08 May, 2025 - Comments: 0

Silent data errors are raising concerns in large data centers, where they can propagate through systems and wreak havoc on long-duration programs like AI training runs. SDEs, also called silent data corruption, are technically rare. But with many thousands of servers, which contain millions of processors running at high utilization rates, these damaging events become common in large fleets. ... » read more

E-Beam Inspection Proves Essential For Advanced Nodes
By Gregory Haley - 08 May, 2025 - Comments: 0

Electron-beam inspection is proving to be indispensable for finding critical defects at sub-5nm dimensions. The challenge now is how to speed up the process to make it economically palatable to fabs. E-beam inspection's notorious sensitivity-throughput tradeoff has made comprehensive defect coverage with e-beam at these advanced nodes especially problematic. For Intel’s 18A logic node (~1.... » read more

Who Is Most Likely To Link Financial And Manufacturing Data?
By Anne Meixner - 08 May, 2025 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss which companies have the most to gain from linking financial data with manufacturing data analytics platforms with Dieter Rathei, CEO of DR Yield; Jon Holt, senior director of product management at PDF Solutions, Alex Burlak, vice president of advanced analytics and test at proteanTecs; and Dirk de Vries, technical program ma... » read more

Need For Speed Drives Targeted Testing
By Gregory Haley - 23 Apr, 2025 - Comments: 0

As packaging complexity increases and nodes shrink, defect detection becomes significantly more difficult. Engineers must contend with subtle variations introduced during fabrication and assembly without sacrificing throughput. New material stacks degrade signal-to-noise ratios, which makes metrology more difficult. At the same time, inspection systems face a more nuanced challenge — how t... » read more

Secure Handling Of Financial Data In Manufacturing
By Anne Meixner - 21 Apr, 2025 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss the advantages associated with linking financial data with manufacturing data analytic platforms, real security challenges and the best uses for AI/ML methods, with Dieter Rathei, CEO of DR Yield; Jon Holt, senior director of product management at PDF Solutions, Alex Burlak, vice president of advanced analytics and test at p... » read more

Why Thin Film Measurements Matter
By Laura Peters - 08 Apr, 2025 - Comments: 0

Semiconductor devices are becoming thinner and more complex, making thin deposited films even harder to measure and control. With 3nm node devices in production and 2nm nodes ramping toward first-silicon, the importance of precise film measurement is only growing in significance as fabs seek to maintain the performance and reliability of leading-edge devices. Whether it’s the read and writ... » read more

Nearly Invisible: Defect Detection Below 5nm
By Gregory Haley - 08 Apr, 2025 - Comments: 0

Detecting sub-5nm defects creates huge challenges for chipmakers, challenges that have a direct impact on yield, reliability, and profitability. In addition to being smaller and harder to detect, defects are often hidden beneath intricate device structures and packaging schemes. Moreover, traditional optical and electrical probing methods, trusted for decades, are proving inadequate against ... » read more

Hunting For Macro Defects
By Anne Meixner - 08 Apr, 2025 - Comments: 0

Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the wafer level, a macro-defect can affect more than one die, and in some cases large regions of a wafer. Finding macro defects can indicate a significant issue with a process module, a particular fi... » read more

Need For KGD Drives Singulated Die Screening
By Anne Meixner - 31 Mar, 2025 - Comments: 0

The move to multi-die packaging is driving chipmakers to develop more cost-effective ways to ensure only known-good die are integrated into packages, because the price of failure is significantly higher than with a single die. Better methods for inspecting and testing these devices are already starting to roll out. High-throughput infrared inspection is capable of catching more sub-surface d... » read more

Chip Failures: Prevention And Responses Over Time
By Ed Sperling - 19 Mar, 2025 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss the causes of chip failures, how to respond to them, and how that can change over time, with Steve Pateras, vice president of marketing and business development at Synopsys; Noam Brousard, vice president of solutions engineering at proteanTecs; Harry Foster, chief verification scientist at Siemens EDA; and Jerome Toublanc, hi... » read more

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