Enhancing High Bandwidth Memory (HBM) Reliability With 3D X-ray Inspection


High Bandwidth Memory (HBM) is revolutionizing AI, high-performance computing, and advanced graphics systems. Its 3D architecture—stacked DRAM dies interconnected via through-silicon vias (TSVs)—delivers exceptional bandwidth and efficiency. But this complexity introduces new challenges for inspection and quality assurance. Why 3D X-ray for HBM? Traditional 2D X-ray imaging cannot fully v... » read more

Home Win: Challenging The Traditional Semiconductor Manufacturing Model


Across Europe, many of us have grown accustomed to a model where semiconductor products, subassemblies and components are sourced from the Far East almost by default. The rationale has always been clear: significantly lower labor and manufacturing costs made offshore supply the most commercially viable option. Yet, while this approach has long been convenient, it has never been without compromi... » read more

The Smart Advantage: How Artificial Intelligence Is Transforming Inspection And Metrology In Semiconductor Manufacturing


There is no doubt that the semiconductor industry is in an era of rapid and profound transformation, driven by an increasing demand for smaller, faster, and more powerful chips. As the speed of innovation continues to advance, so does the pressure on semiconductor manufacturers to detect and address defects and inconsistencies with near-perfect accuracy to keep pace with this demand. Manual ... » read more

Encapsulating Wearable Sensors Using A Pre-Mixed Two-Part Epoxy


By Anthony Buzzerio, Venkat Nandivada, and Rohit Ramnath The growing field of wearable medical technology relies heavily on miniaturized sensors capable of providing accurate and continuous physiological data. Ensuring the long-term reliability and performance of these sensors — often subjected to demanding conditions including physical stress, thermal fluctuations, and exposure to bodily ... » read more

Micro Dispensing: From Semiconductors To Sushi


The phrase “micro fluid dispensing” is generally associated with applications like medical device assembly or battery manufacturing. It certainly doesn’t conjure up visions of sushi – at least not yet. If engineers at IHI Aerospace and Yamagata University have their way, though, 3D printed sushi will be served to space tourists as they circle in low Earth orbit. Yes, printed sush... » read more

X-ray Inspection In The Semiconductor Industry


With the ever-present pressure to produce more efficient devices with more power, the sizes of the structures and electrical connections in the production of chips have become smaller and smaller. In addition, the sheer number of these connections in a given unit area have also increased in a spectacular way. At the heart of all X-ray inspection, whether it is manual or fully automated metrolog... » read more

Five Smart Ways To Improve EV Battery Production


Batteries and battery management systems are the heart of today's electric vehicles. These components define the performance, safety, and driving range of more than 16.5 million1 electric vehicles currently on the road. As electric vehicle and battery manufacturers continue to look for ways to increase the efficiency and speed of their production processes, many turn to Nordson EFD for prec... » read more

Effect Of RF Plasma Process Gas Chemistry And Electrode Configuration On The Removal Of Copper Lead Frame Oxidation


By Daniel Chir and Johnson Toh Lead frame surface oxidation can lead to surface delamination after molding or wire bonding issues. The application of plasma treatment has been proven to be safe and effective solution to address these issues. However, the effectiveness of plasma treatment for removing oxide is dependent on the correct use of recipe parameters, gas chemistry and electrode conf... » read more

Bump Height Uniformity And 3D Sensing


Achieving 3D sensing for semiconductor bump height uniformity is essential before adding photoresist. But there are challenges in using traditional methods for measuring uniformity after copper plating, which requires a combination of 3D fringe projection technology and NanoResolution inspection and metrology. Here’s what we’ve learned in a bump height uniformity case study: » read more

Deep Learning Delivers Fast, Accurate Solutions For Object Detection In The Automated Optical Inspection Of Electronic Assemblies


When automated optical inspection (AOI) works, it is almost always preferable to human visual inspection. It can be faster, more accurate, more consistent, less expensive, and it never gets tired. However, some tasks that are very simple for humans are quite difficult for machines. Object detection is an example. For example, shown an image containing a cat, a dog, and a duck, a human can insta... » read more

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