Automotive Semiconductors Require Integrated Test Solution


The automotive semiconductor test market is experiencing organic growth as chipmakers produce higher volumes of devices serving an array of automotive applications. In addition, the range of applications for automotive-grade semiconductors is evolving as the technology advances. Manufacturers of automated test equipment (ATE) are adapting to ensure their systems can handle devices ranging from ... » read more

The Future Of Data Analytics And Semiconductor Testing


The world is changing more rapidly than ever. With the explosion of Artificial Intelligence (AI), Machine Learning (ML) and data analytics, semiconductor manufacturers now have the opportunity to extract valuable insights from the massive amounts of data being generated throughout the silicon lifecycle. By leveraging AI algorithms and ML, semiconductor manufacturers can now optimize silicon des... » read more

The Crucial Role Of High-Performance Computing In 2024: Balancing Cost And Innovation


We live in a world where digital queries run the Information Superhighway and in turn, our lives. This means that the importance of High-Performance Computing (HPC) cannot be overstated. The technology behind this continues to be a cornerstone for advancing our world and improving productivity. To put it another way, can you imagine a day, a week, when you are not querying something? So, let... » read more

True Zero Trust Combats IC Manufacturing Security Challenges


The semiconductor manufacturing industry is facing a host of unprecedented technology and security challenges. A common catchphrase these days is that “data is the new oil.” Data is everywhere, in everything we do, and there is both good and bad associated with this trend. Data everywhere creates new security issues that need to be addressed to protect the integrity of your information and ... » read more

Meeting The Test Challenges Of Ultra-Wideband Chipsets


By Kevin Yan and Daniel Sun This article is adapted from a paper and presentation at SEMICON China, March 2023. Ultra-wideband (UWB) technology, as defined by IEEE 802.15.4 and 802.15.4z standards, enables short-range, low-power RF location-based services and wireless communication. A variety of devices have reached the market to help implement UWB capability, but these devices present si... » read more

Deploying Cutting-Edge Adaptive Test Analytics Apps


By Ken Butler, Advantest, and Guy Cortez, Synopsys Semiconductor test challenges abound in this era of AI. As such, semiconductor test engineering is increasingly moving towards fully adaptive test where each device receives the “right” test content to assess its correctness. Advantest and Synopsys have partnered to provide new cutting-edge real-time adaptive test applications at the te... » read more

Comparison Of State-Of-The-Art Models For Socket Pin Defect Detection


This article is adapted from a presentation at TestConX, March 5-8, 2023, Mesa, AZ, by Vijayakumar Thangamariappan, Nidhi Agrawal, Jason Kim, Constantinos Xanthopoulos, Ira Leventhal, and Ken Butler, Advantest America Inc., and Joe Xiao, Essai, Advantest Group. Test sockets have a key role to play in the semiconductor test industry. A socket serves as the critical interface between a teste... » read more

MMAF Option Enables Picoampere Measurements


By Yoshiyuki Aoki and Tsunetaka Akutagawa Demand for low-current devices is increasing, as many new sensors are being created for medical, automotive, industrial, and other applications. Chief among the heightened production and test requirements for these low-current devices is the need to achieve picoampere (pA)-class measurements. Sensors’ functionality and efficacy, especially in medic... » read more

Design Considerations For Ultra-High Current Power Delivery Networks


This article is adapted from a presentation at TestConX, March 5-8, 2023, Mesa, AZ. A power-delivery network (PDN), also called a power-distribution network, is a localized network that delivers power from voltage-regulator modules (VRMs) throughout a load board to the package’s chip pads or wafer’s die pads. The PDN includes the VRM itself, all bulk and localized capacitance, board vi... » read more

Power-Supply Card Targets High-Voltage PMIC Test


The electronics industry is seeing a move toward higher voltages and currents to deliver sufficient supply and charging power in products ranging from handheld cellphones and tablets to workstations. This trend is evidenced in examples such as the many USB power-delivery (PD) profiles with ratings ranging from 10W (5V at 2A for USB PD 3.0 profile 1) up to 100W (5V at 2A, 12V at 5A, and 20V at 5... » read more

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