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Driving Toward Predictive Analytics With Dynamic Parametric Test


The foundation of parametric test within semiconductor manufacturing is its usefulness in determining that wafers have been fabricated properly. Foundries use parametric test results to help verify that wafers can be delivered to a customer. For IDMs, the test determines whether the wafers can be sent on for sorting. Usually inserted into the semiconductor manufacturing flow during wafer fabric... » read more

Hybrid System-Level Test For RF SiP


In recent years, the proliferation of the IoT has focused attention on low-power-wireless applications. IoT modules incorporating functions such as Bluetooth Low Energy (BLE) transceivers, MCUs, and power-management circuitry are becoming system-in-package (SiP) and even one-chip devices. Such devices increase the demand for a mass-production test environment that can measure them in a short ti... » read more

Testing AiP Modules In High-Volume Production


Far-field and radiating near-field are two options for high-volume over-the-air (OTA) testing of antenna-in-package (AiP) modules with automated test equipment (ATE) [1]. In this article, we define an AiP device under test (DUT) and examine the measurement results from both methods. Creating an AiP evaluation vehicle Proper evaluation of an ATE OTA measurement setup requires an AiP module. Us... » read more

ATE In The Age Of Convergence And Exascale Computing


We are currently in the midst of the age of convergence – that is, the convergence of data from a range of applications and data sources. These sources constitute anything that creates data – ranging from human-created data, such as voice and video, through automotive, mobile, and wireless/IoT devices. This also includes edge computing and servers storing the massive amounts of data needed ... » read more

Parallel RF Test For Next-Generation Communications


The test economics of state-of-the-art smartphones, tablets and routers demand highly parallel RF test. We are addressing this next wave in RF communications test, enabled by Wi-Fi 6E, operating in the 6GHz band and coming up to 7.125GHz. This forthcoming update to the Wi-Fi standard will extend the features and capabilities, including higher performance, lower latency, and faster data rates fo... » read more

System-Level Test Methodologies Take Center Stage


Because electronic systems for all applications in end-user markets must provide the highest possible reliability to match customers’ quality expectations, semiconductor components undergo multiple tests and stress steps to screen out defects that could arise during their lifecycle. Due to new semiconductor devices’ increasing design complexity and extreme process technology, increased test... » read more

3D Metal Printing: Does It Add Up?


Prolific Renaissance artist Michelangelo said, “The sculpture is already complete within the marble block before I start my work. ... I just have to chisel away the superfluous material.” I wonder what the great visionary would think of exchanging his chisel for an additive-manufacturing tool such as today’s 3D printers. 3D printing has been around since the 1980s, when it was first kn... » read more

How Do I Know? A Machine Told Me So


More than 375 years ago, René Descartes wrote “I think, therefore I am.” And “Think” has been a slogan used by no less a technology giant than IBM for more than a century. The thought process has been a defining aspect of humanity since our beginning. But now technologists are working to imbue that capability into machines through artificial intelligence. Programming computers is no... » read more

Blockchain Technology Is Coming To An Application Near You


Throughout the history of the semiconductor industry, disruptive IC technologies have been brainstormed and developed by innovative thinkers, offered up for global consideration through technical papers and conferences, discussed and scrutinized, put to the test at alpha and beta sites, and – once proven – adopted for widespread use. The path is similar for inventive applications. Blockc... » read more

Anticipating And Addressing 5G Testing Challenges


It’s no surprise that each new generation of ICs raises new sets of challenges in device testing. Changes in pin counts, data-transfer rates and interface protocols present different requirements. With the coming fifth generation (5G) of semiconductor technology, producers of automatic test equipment (ATE) must develop new test solutions with advanced capabilities on several fronts. Perhap... » read more

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