category: Intelligent Innovation

category: Auto, Security & Edge AI

Photoluminescence Inspection Is Changing How Manufacturers Protect Yield In SiC And GaN Devices
By Jason Lin - 07 Jul, 2026 - Comments: 0

Electric vehicles, fast-charging infrastructure, renewable energy systems, and industrial power conversion are redefining what power semiconductors need to deliver: higher voltages, higher power densities, faster switching, and longer lifetimes. To meet these demands, manufacturers are increasingly turning to wide-bandgap materials like silicon carbide (SiC) and gallium nitride (GaN). SiC ha... » read more

Effective UX/UI Is A Critical Link Between AI Insights And Yield Improvement
By Keira Lai - 09 Jun, 2026 - Comments: 0

The semiconductor industry is undergoing a fundamental shift in how data is generated, analyzed, and acted upon thanks to the integration of AI into process control flows. As AI becomes more deeply integrated into the manufacturing process, its value is increasingly determined not by data-driven decision making alone, but by how effectively its outputs are delivered, interpreted, and acted upon... » read more

The Specialty Device Surge Part 3: Solving The Process Control Challenges Of MEMS, Photonics, Co-Packaged Optics, And More
By Christopher Haire - 12 May, 2026 - Comments: 0

Every day, consumers rely on an invisible network of specialty semiconductor devices without realizing it. The smartphone in your pocket is a good place to start. It knows when you rotate the screen thanks to MEMS sensors, and its camera delivers crisp images through advanced CMOS image sensors. Meanwhile, fast charging technology, wireless connectivity, facial recognition, and high-frequency c... » read more

The Specialty Device Surge Part 2: The Process Control Challenges Of MEMS, Co-Packaged Optics, And More
By Christopher Haire - 07 Apr, 2026 - Comments: 0

In a world where high-bandwidth memory, GPUs, and advanced AI packages are all the rage, it is easy to forget the important role specialty devices play. These unsung heroes of modern life perform critical functions across a wide range of industries, including automotive, telecommunications, data centers, emerging AI hardware ecosystems, and consumer electronics, just like the smartphone in your... » read more

The Specialty Device Surge, Part 1: Wafer Size Transitions Are Powering The Future Of Specialty Devices And Bringing New Challenges
By Christopher Haire - 10 Mar, 2026 - Comments: 0

Specialty devices are the unsung heroes of modern life. For many in the semiconductor industry today, the spotlight is on the SiC and GaN power devices used in automotive, green energy, fast-charge consumer electronics (CE), and high-performance computing (HPC) applications (Figures 1 and 2). However, specialty devices are more than just power devices. They are a broad class of semiconductor... » read more

A Clear Advantage: Precision Glass Carrier Inspection For AI And HPC Markets
By Jason Lin - 13 Jan, 2026 - Comments: 0

If you’ve been following the evolution of advanced packaging, you know that the industry is pushing boundaries like never before. From high-performance computing to industry-upending AI devices, the demand for smaller, faster, and more powerful chips is driving innovation at every level. One of the unsung heroes in this transformation: Glass carriers. These carriers are becoming essential ... » read more

Smaller Geometries, Bigger Demands: The Role Of OCD In GAA Logic And Vertical Gate DRAM Process Control
By Jiangtao Hu - 09 Dec, 2025 - Comments: 0

AI workloads are pushing the boundaries of compute, memory, and interconnect architectures, and to meet these goals, manufacturers are rapidly accelerating advanced logic and DRAM development. Chief among these innovations: gate-all-around (GAA) logic transistor and vertical gate (VG) DRAM, two device architectures that promise higher performance, improved power efficiency, and greater scalabil... » read more

Interconnect Innovations In High Bandwidth Memory: Part 2
By Damon Tsai - 14 Oct, 2025 - Comments: 0

By Damon Tsai, Woo Young Han, and Tim Kryman Interconnect technology in high bandwidth memory (HBM) is at a fork in the road. One direction leads to tried-and-true microbump technology, and the other leads to a compelling alternative, hybrid bonding. Both technologies are evolving to address the stringent requirements of next generation HBM in pursuit of increased I/O density supporting high... » read more

Interconnect Innovations In High Bandwidth Memory: Part 1
By Damon Tsai - 09 Sep, 2025 - Comments: 0

By Damon Tsai, Woo Young Han, and Tim Kryman The demand for high bandwidth memory (HBM) is accelerating across the semiconductor industry, driven by boundary-pushing artificial intelligence, high-performance computing, and advanced graphics. These technologies require access to vast datasets, which in turn increases the need for memory solutions that combine speed, density, and power efficie... » read more

Comprehensive Process Control Solutions For Through-Glass Vias
By Monita Pau - 12 Aug, 2025 - Comments: 0

At some point in our lives, we have dropped a drinking glass or knocked over a glass-blown knickknack, only to watch it hit the floor and shatter into pieces. We learn from any early age that glass is fragile. But if glass is so fragile, why are manufacturers adopting glass core substrates? Good question. And one that comes with a ready answer. Glass is able to meet the new, denser line-s... » read more

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