category: Intelligent Innovation

category: IoT, Security & Automotive

Using Advanced Analytics To Meet ESG Goals
By Mike McIntyre - 06 Jun, 2023 - Comments: 0

With the continued advancement of environmental, social and governance goals, corporations are increasingly focused on reducing their carbon footprints. To accomplish this, these companies are being asked to operate their businesses more efficiently than ever before, whether the matter is reducing waste, water usage or power consumption. This is true for the semiconductor industry as well. A... » read more

Addressing Yield Challenges In Advanced IC Substrate (AICS) Packaging
By Keith Best - 09 May, 2023 - Comments: 0

No matter how you get your news, it seems like everyone is talking about AI – and it’s either going to usher in a new era of productivity or lead to the end of humankind itself. Regardless, the AI era is here, and it’s just beginning to have an impact on our lives, our jobs and our future. To meet the rigorous demands of AI – along with high-performance compute, 5G and electric vehic... » read more

Using Machine Learning To Increase Yield And Lower Packaging Costs
By Melvin Lee - 11 Apr, 2023 - Comments: 0

Packaging is becoming more and more challenging and costly. Whether the reason is substrate shortages or the increased complexity of packages themselves, outsourced semiconductor assembly and test (OSAT) houses have to spend more money, more time and more resources on assembly and testing. As such, one of the more important challenges facing OSATs today is managing die that pass testing at the ... » read more

Addressing Total Overlay Drift In Advanced IC Substrate (AICS) Packaging
By Keith Best - 07 Mar, 2023 - Comments: 0

For years, many in the semiconductor industry have focused on the march toward advanced nodes. As these nodes have decreased in size, the size of input/output (I/O) bumps on the chip has grown smaller. As these bumps shrink, their ability to mate directly to printed circuit boards (PCB) diminishes, which, in turn, leads to the need for an intermediary substrate. Enter the advanced IC substrate ... » read more

A Star Is Born: Gallium Nitride And The Coming Age Of Compound Semiconductors
By Wei Zhao - 07 Feb, 2023 - Comments: 0

Not so long ago, Blu-ray was hailed as a technological advancement in the world of digital video. But in the streaming era, Blu-ray’s luster has faded. However, the technology responsible for the blue laser diode that gave the Blu-ray player its name – gallium nitride (GaN) – is emerging as one of a number of exciting new developments in the semiconductor industry. Today, GaN is used b... » read more

Metrology Sampling Plans Are Key For Device Analytics And Traceability
By Mike McIntyre - 06 Dec, 2022 - Comments: 0

A mother steps on the brakes, bringing her car to a stop as she drops her kids off for dance lessons. At the time, she doesn't notice anything wrong, but when she takes her car in for its regular service appointment, the mechanic conducts a diagnostic check and discovers that the primary brake system on the car had failed because of a faulty braking controller without anyone realizing it. Fortu... » read more

Heterogeneous Integration: Correcting Overlay Errors On Advanced Integrated Circuit Substrates (AICS)
By John Chang - 08 Nov, 2022 - Comments: 0

By John Chang, with Corey Shay, James Webb, and Timothy Chang For high-performance computing, artificial intelligence, and data centers, the path ahead is certain, but with it comes a change in substrate format and processing requirements. Instead of relying on the quest for the next technology node to bring about future device performance gains, manufacturers are charting a future based inc... » read more

Heterogeneous Integration: Exposing Large Panels With Fewer Shots
By John Chang - 11 Oct, 2022 - Comments: 0

By John Chang, with Corey Shay, James Webb, and Timothy Chang The More than Moore era is upon us, as manufacturers increasingly turn to back-end advances to meet the next-generation device performance gains of today and tomorrow. In the advanced packaging space, heterogeneous integration is one tool helping accomplish these gains by combining multiple silicon nodes and designs inside one pac... » read more

Hunting For Macro Defects: The Importance Of Bare Wafer Inspection
By Aseem Srivastava - 08 Sep, 2022 - Comments: 0

As logic and memory semiconductor devices approach the limits of Moore’s Law, the requirements for accuracy in layer transfer become increasingly stringent. One leading silicon wafer manufacturer estimates that 50% of epitaxial wafer supply for logic will be on nodes equal to or less than 7nm. This is up approximately 30% from earlier in the decade. To meet the demands of extreme ultraviol... » read more

Sky High: More Thoughts To Consider Before Transitioning To The Cloud
By Miki Banatwala - 09 Aug, 2022 - Comments: 0

In our previous blog, I talked about the essential factors that a company must consider in leveraging cloud resources to accelerate their goals. The objective here is not just about putting some of the workload in the cloud; rather, it is about realizing the transformation adopting cloud technologies will bring about. In particular, it is more important to think of the cloud not only as a set o... » read more

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