Top Stories

Thinking Outside The Chip
Intel joins AMD, IBM on advanced packaging; performance is the key driver.

More Uses For Hypervisors
Multicore, multi-chip systems and security provide new reasons to extend this technology for years to come.

Predictions For 2016: Markets
Automotive, IoT and China to lead the way, with gains expected in design and related areas such as big data management.

One On One: John Lee
Applying big data techniques and machine learning to EDA and system-level design.

Blogs

Editor in Chief Ed Sperling contends that big changes are ahead with all the industry leaders backing new packaging approaches, in Advanced Packaging Is Real. Now What?

Executive Editor Ann Steffora Mutschler digs into the reasons we still need new chips in the cloud computing era, in Why Build New Silicon?

ARM’s Brian Fuller finds that intelligent software, the right processor and constant calibration can prevent nausea, in Solving ‘Simulator Sickness’ With Smart Software, SoC Design.

Rambus’ Steven Woo zeroes in on problems caused by the fact that not all technology advances at the same pace, in Shifting Performance Bottlenecks Driving Change In Chip And System Architectures.

Mentor Graphics’ Abishek Ranjan, Saurabh Shrimal and Sanjiv Naryan look at how to explore multiple design choices fast, in Micro-Architectural Exploration For Low Power Design.

Synopsys’ Mike Thompson observes that looking back a decade may give some hint about just how much things will change over the next 10 years, in 2026: I Can Only Imagine…