Special Report
Thermal Damage To Chips Widens
Heat issues resurface at advanced nodes, raising questions about how well semiconductors will perform over time for a variety of applications.
Top Stories
Debug Becomes A Bigger Problem
EDA companies have been developing more integrated debug flows that bring execution engines and hardware and software closer together, but is that enough?
Adventures In Assembly
How engineering teams are approaching SoC assembly is changing.
Powerful New Standard
A new version of IEEE 1801 enables complete power-aware flows to be constructed using a meet-in-the-middle concept. What will it mean to you and what new parts of the flow will it enable?
Blogs
Editor in Chief Ed Sperling finds the jury is still out about how widespread the most advanced packaging approaches will become, in Will 3D-IC Work?
Executive Editor Ann Steffora Mutschler contends that current technologies need to continue evolving to meet the needs of complex embedded systems, in Where We Go From Here.
Synopsys’ Srikanth Jadcherla compares cooking to chip design, in Power-Performance-Thermal.
ARM’s Brian Fuller looks at what it takes to succeed in the burgeoning automotive market, in What The Next Era Of Automotive Design Will Require.
Mentor Graphics’ Ellie Burns digs into the new IEEE 1801 standard and what you need to know about it, in Automating Coverage And Analysis Of Low Power Designs.
Ansys’ Binu Abraham describes a methodology for power noise and reliability closure for advanced SoCs, in Working With FinFETs.
