Top Stories

First Look: 5nm
The first test chips are out the door, but there’s a lot more work and uncertainty ahead.

Analog Meets Power In Standards Groups
Exclusive: New efforts and approaches seek to widen appeal and usefulness of IC standards.

Gaps In Performance, Power Coverage
Coverage tells us when we have done enough functional verification, but what about power and performance? How do you know you have found the worst case?

Power, Standards And The IoT
Experts at the table, part 1: What’s missing from power standards and who will benefit once they’re created.

Blogs

Editor in Chief Ed Sperling contends that standards efforts will have to be expanded in the increasingly connected world, in Bigger Standards Required.

Executive Editor Ann Steffora Mutschler argues that it’s not enough to look at power in a standalone way anymore, in Power Requires Holistic Perspective.

ARM’s Brian Fuller looks at what happens when you combine the LEGO with crowdsourcing, in Think In Blocks.

Synopsys’ Srikanth Jadcherla observes that in the IoT era we will have to start looking at power in reverse, in Outbound Power Management.

Mentor Graphics’ Nicolas Williams and Qi Jing offer some ideas about what to do when your familiar EDA tools aren’t working, in Raising The IQ Of Your MEMS-based IC Design Flow.

Ansys’ Norman Chang digs into how to efficiently and accurately calculate the temperature increase on millions of wires due to self-heat, in Accurate Thermal Analysis, Including Thermal Coupling Of On-Chip Hot Interconnect.

Cadence’s Paul McLellan points out that phones are never actually off, but that does mean they can’t be more efficient, in Is It Hot? Ask Joules.