Top Stories
Can Today’s Processor Architectures Be More Efficient?
The low-hanging fruit of processor optimization may be gone, but new technologies are emerging.
Often Overlooked, PHYs Are Essential To High-Speed Data Movement
From smartphones to AI factories, physical layers are the unsung heroes of data communications.
When Can I Buy A Chiplet?
A chiplet ecosystem is under development, but many barriers must be overcome before a thriving marketplace can exist.
Video
LLMs On The Edge
What’s needed to utilize advances in AI for small devices.
Opinion
Data Center CPU Dominance Is Shifting To AMD And Arm
AMD is close to surpassing Intel in x86, but Arm thinks it can take the lead over x86.
Sponsor Blogs
Expedera’s Paul Karazuba examines the new challenges introduced with complex model architectures, demanding runtime computations, and transformer-specific operations, in Transformers At The Edge: Efficient LLM Deployment.
Fraunhofer’s Andy Heinig finds that a full-fledged ecosystem will require much more than just standardized die-to-die interfaces, in Do We Have Enough Standards For An Open-Chiplet Ecosystem?
Synopsys’ Bradley Geden and Manoz Palaparthi explain why increased SoC complexity requires verification flows to capture both the intent and integrity of a design, in RTL Signoff vs. Functional Signoff: What’s The Difference?
Rambus’ Lou Ternullo promotes the need for flexibility to support composability in high-speed interconnects, in Scaling In The AI Era: The Role Of PCI Express 7.0 Switches In Next-Gen Data Centers.
Quadric’s Steve Roddy contends that rapid innovation in transformer networks has rendered the simple offload NPU obsolete, in That’s Not A DSP!
Siemens’ Andras Vass-Varnai, Lee Wang, John Parry, Byron Blackmore, and Sudarshan Deo look to automated workflows to bridge the gap between electrical/package design and thermal analysis in stacked die, in A Better Path To Better 3D-IC Thermal Modeling.
Cadence’s Reela Samuel argues that a dedicated computing infrastructure is needed to oversee the complete AI life cycle, in Designing The AI Factories: Unlocking Innovation With Intelligent IP.
Ansys’ Sanjay Angadi and Matteo Nicolich look at the potential impact of one design change on other parts of a design, in From Data To Decisions: Exploring Enterprise Digital Thread Strategy And Simulation.
Arm blogger Peter Ma digs into unpredictable cloud CPU costs, in Scaling Real-Time Visitor Ingestion And ML Inference.
Sponsor White Papers
Exploring The Latest Innovations In MIPI D-PHY And MIPI C-PHY
The latest advancements in these specifications and their potential to change vision and imaging technologies.
eBook: Optimizing Analog Design With Multiphysics
A platform-based approach to multi-physics simulation that gives engineering teams the tools to design, verify, and optimize AMS systems with greater speed and accuracy.
Semiconductor Value Chain With A Focus On IP Providers
How IP providers are pivotal within the semiconductor value chain, especially in the chip design phase.
Report: The AI Efficiency Boom
Smaller models and accelerated compute are transforming AI at the edge.
Expanding Server Memory Capabilities With Multiplexed Rank DIMM (MRDIMM) Technology
An overview of the MRDIMM technology as a solution to memory bandwidth and capacity challenges.
Finding And Fixing Leakage Between Power Domains
Identifying inter-domain leakage is a two-stage process.
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