Special Report
The Best DRAMs For Artificial Intelligence
The choice of DRAM depends on where the action is.
Top Stories
RISC-V’s Increasing Influence
Does the world need another CPU architecture when that no longer reflects the typical workload? Perhaps not, but it may need a bridge to get to where it needs to be.
Multi-Die Assemblies Complicate Parasitic Extraction
What used to be an afterthought is now a first-order concern for performance and power at the leading edge.
Connecting AI Accelerators
How to put the pieces together in a complex design using AI is an unsolved problem.
Sponsor Blogs
Quadric’s Steve Roddy predicts that the IP industry, which is no stranger to boom and bust cycles, is at the crest of another wave, in The Coming NPU Population Collapse.
Synopsys’ Frank Malloy talks about taming multi-die design complexity and how it will require broad industry collaboration and an evolution of skillsets, in Industry Leaders Provide Insights And Guidance On Multi-Die Designs.
Fraunhofer’s Roland Jancke explains why addressing complex design issues early in the flow can save time and improve quality, in Model-Based Systems Engineering.
Siemens’ Harry Foster outlines how integrated workflows provide a clearer path from RTL to full-system coverage, in Smarter, Faster, Leaner: Rethinking Verification For The Modern Era.
Rambus’ Carlos Weissenberg analyzes new memory module form factors and how interface technologies will meet the demands of AI PCs, in Meeting The Performance Demands Of The Next-Gen Client PC Market.
Arm’s Christoffer Dall offers a solution for ensuring the right processor handles the right task at the right time, in Introducing GICv5: Scalable And Secure Interrupt Management For Arm.
Ansys’ Jennifer Procario considers leveraging reduced-order models to enhance digital twins and AI/ML training, in Simplify Simulation With Reduced-Order Modeling.
Cadence’s Robbie O’Sullivan highlights real world verification challenges and solutions, such as incremental elaboration, in Verification Software And Methodology Insights.
Sponsor White Papers
Measurements and Simulation-Based Characterization Of eFuses
Test bench, modeling, simulation results and virtual development and validation of electronic fuses.
Introducing a Digital Engineering Methodology To Aid All Engineers
Bringing together all elements across disciplines and throughout design, simulation, analysis, and validation into one digital engineering methodology.
Configurability In The Design Of Integrated Chipsets
Whether designing a monolithic IC or a chiplet-based IC, considering configurability at the architectural level is critical.
Designing For Reliability With A System Life Estimator
Bottom-up approach to system life estimation, integrating lab validation, statistical models, and industry standards.
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