Top Stories
3D-IC For The Masses
Advanced assemblies have enabled an unprecedented rate of advancement in the data center, especially for neural processing, but can it expand beyond that?
Chiplets Add New Power Issues
Well-understood challenges become much more complicated when SoCs are disaggregated.
Integrating Data From Design, Manufacturing, And The Field
Knowing where circuits came from, and the conditions in which they operate, can help designers optimize devices already in the field.
What Scares Chip Engineers About Generative AI
ChatGPT isn’t coming for your job, but that doesn’t mean there’s nothing to be concerned about.
Opinion
Power architect Barry Pangrle delves into the papers presented at ISSCC about an approach that improves energy efficiency and reduces power using three coupled control loops, in Reducing Voltage Guard Band.
Sponsor Blogs
Synopsys’ Vin Liao and Robert Ruiz explain how to make each iteration of the compile-run-debug loop shorter by replacing the design with an automatically generated testbench stub, in Easier Assertion Development And Debug With Simulation Replay.
Rambus’ Raj Uppala looks at key improvements in MIPI’s Camera Serial Interface 2 protocol, such as an always-on sentinel conduit and unified serial link encapsulated transport, in Enabling Next-Generation Automotive Zonal Architecture With MIPI.
Siemens’ Pratyush Kamal explores how AI optimization engines can play a role in finding optimized global solutions across multi-variate problems, in Fulfilling 3D-IC Trade-Off Analyses (And Benefits) With An AI Assist.
Cadence’s Pamula Sai Srinivas illustrates the importance of choosing the appropriate drive strength to meet timing constraints while minimizing power and area, in Static Timing Analysis: Cell Delay Vs. Cell Drive Strength.
Ansys’ Ka-lip Chu digs into challenges in meeting the ISO 26262 standard and Automotive Safety Integrity Levels, in The Importance Of Safety Analysis In Automotive Systems Engineering.
Arm’s Máté Stodulka and Tomas Zilhao Borges show how to predict dynamic behaviors in a physics system in a way that’s computationally efficient and adaptable to a range of scenarios, in Physics Simulation With Graph Neural Networks Targeting Mobile.
Quadric’s Steve Roddy details porting challenges in new and complicated transformer models aimed at advanced automotive use cases, such as enhanced object detection and recognition in L3/4/5 ADAS, in No Fooling With Voxel Pooling.
Sponsor White Papers
New Innovative Way To Functionally Verify Heterogeneous 2D/3D Package Connectivity
Using formal for connectivity verification early in the design flow can reduce time to market.
Silicon Reimagined: New Foundations For The Age of AI
How silicon technologies are evolving to meet the unprecedented computational demands of AI, while addressing critical challenges around power efficiency, security, and software.
Application Of External CFD Modeling In Data Center Design
Designing data centers for increasing IT densities and AI workloads.
Unlocking Generative AI On The Edge Across The Semiconductor Value Chain
As edge GenAI necessitates specialized, highly efficient hardware solutions, these demands are generating growth opportunities and driving demand across the chip industry ecosystem.
LLE-Aware Design Methodology To Avoid Timing And Power Pessimism
An LLE-aware design flow that increases design operating frequency while reducing power.
Extracting Parasitic Impedance Of Semiconductor Power Modules
The challenges of power module design and electromagnetic effects in high-density power converters.
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