Special Report
The Rising Price Of Power In Chips
More data requires faster processing, which leads to a whole bunch of problems — not all of which are obvious or even solvable.
Top Stories
Backside Power Delivery Adds New Thermal Concerns
Lack of shielding, routing issues, and new mechanical stresses could have broad impact on standard cell design.
Photonics: The Former And Future Solution
Twenty-five years ago, photonics was supposed to be the future of high technology. Has that future finally arrived?
Optimizing Energy At The System Level
A lot of effort has gone into optimization of hardware during implementation, but that is a small fraction of the total opportunity.
Videos
New Issues In Power Semiconductors
Challenges increase with higher voltage and heterogeneous integration in advanced packages.
Blogs
Fraunhofer IIS/EAS’s Andy Heinig finds that different markets require additional chiplet standards that address more than just interfaces, in Current And Future Challenges For An Open Chiplet Ecosystem.
Siemens’ Keith Felton and Todd Burkholder contend that instead of stalling out, Moore’s Law will be revitalized and turbocharged, in The City In The Tower: 3D-ICs Transform The Electronics System Landscape.
Synopsys’ Taruna Reddy looks at measuring how injected faults propagate through a design and how long they remain in the system, in Verifying Hardware Security With RTL Simulation.
Mixel’s Mahmoud ElBanna and ams OSRAM’s Brian Lenkowski show how event detection enables cameras to switch between high-resolution, high-frame rate, and low-power modes, in Deployment Of MIPI In Ultra-Low-Power Streaming Sensors.
Quadric’s Steve Roddy questions why companies fixate on old technology when new ML networks far outperform them, in Embrace The New!
Rambus’ Emma-Jane Crozier explains why choosing the right memory for AI inference is a balance of bandwidth, capacity, power, and form factor, in The Implications Of AI Everywhere: From Data Center To Edge.
Keysight’s Jenn Mullen lays out why quantum error detection, suppression, and correction strategies are critical to realizing fault-tolerant quantum computers, in Quantum Computing: Top 5 Questions Answered.
Cadence’s Dharini Subashchandran and Shyam Sharma explain the differences in the structure, functionality, and use cases of flash memory, in Flash Memory Demystified: NOR Flash Vs. NAND Flash.
Arm’s Prakash Mohapatra examines the shift from discrete ECUs to zonal controllers in emerging EE architectures, in Easing Automotive Software Migration.
Sponsor White Papers
MIPI Deployment In Ultra-Low-Power Streaming Sensors
Low-power scenarios with streaming sensors connected to a processor via MIPI.
How Multiphysics Simulation Enables 3D-IC Implementation At The Speed Of Light
Chip designers are using novel multiphysics simulation to break the barriers to 3D-IC development.
Overcoming Signal Integrity Challenges Of 112G Connections
How to handle these signal integrity issues and ensure that data is faithfully transmitted with a very low bit error rate (BER).
Effectively Monitor And Streamline Test Processes Using A DAQ
How to effectively monitor and streamline testing using a DAQ.
Simulation With Taint Propagation For Security Verification
Chip designers must take security into account and verification engineers must check that no vulnerabilities exist in the RTL design.
Workload Trace Generation
The basic concepts of performance engineering.
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