Top Stories
Multi-Beam Market Heats Up
Intel to enter equipment market against NuFlare with acquisition at leading edge of mask writing; photomask challenges grow.
Ready For Nanoimprint?
NGL option gains ground and adherents for single-digit process nodes, but more work is still needed.
Where Is Next-Gen Lithography?
Experts at the table, part 1: Ramp up time still in question. Remaining issues include power sources, pellicles, thinner wires, edge placement and cost.
Inside The OSAT Business
How packaging houses compare to foundries, and what impact consolidation will have on different IC manufacturing segments.
Blogs
Editor In Chief Ed Sperling questions what comes next, now that advanced packaging finally is beginning to roll out, in Timing Is Everything.
Executive Editor Mark LaPedus sits down with Toppan’s EVP to talk about masks and strategy, in Insider’s Guide To Photomasks.
Mentor’s Valeriy Sukharev, Jun-Ho Choy, Armen Kteyan and Henrik Hovsepyan dig deep into how to optimize power consumption for mobile devices at advanced nodes, in Reducing Post-Placement Leakage With Stress-Enhanced Fill Cells.
Coventor’s Mattan Kamon compares SAQP and DSA using virtual fabrication, in Will Directed Self-Assembly Pattern 14nm DRAM?
Calibra’s Jan Willis looks at why the industry is changing and what challenges still need to be resolved, in Behind The Scenes In Nanoimprint Lithography.
Michael Watts examines how to build sub-wavelength structures using photons, and using 3D printers to create scaffolds for human cells, in 3D Construction Ahead.
Semico Research’s Joanne Itow predicts new features and chips will boost wafer demand, but not enough to offset a slowdown in this market, in After Smartphones…Less?
SEMI’s Shanshan Du observes that China’s packaging houses have developed strong expertise over the past two decades, in China: Strong Market Growth And Innovation In Packaging.
